Heat-dissipating device

Abstract

An exemplary heat-dissipating device includes a base having a first surface, and a number of fins extending from the first surface. Each fin includes a main body perpendicular to the first surface and an extending portion perpendicularly extending from an end of the main body distal from the first surface.

1 . A heat-dissipating device comprising:
 a base, the base having a first surface, and   a plurality of fins extending from the first surface, each fin comprising a main body perpendicular to the first surface and an extending portion perpendicularly extending from an end of the main body distal from the first surface.   
     
     
         2 . The heat-dissipating device of  claim 1 , wherein each extending portion has a plurality of through holes defined therein. 
     
     
         3 . The heat-dissipating device of  claim 1 , wherein each fin has an L-shaped or T-shaped cross-section. 
     
     
         4 . The heat-dissipating device of  claim 1 , wherein the base comprises a second surface facing away from the first surface and a metal layer arranged over the second surface. 
     
     
         5 . The heat-dissipating device of  claim 4 , wherein the roughness of the metal layer is smaller than 8 nanometers. 
     
     
         6 . The heat-dissipating device of  claim 1 , wherein the base comprises a sealed cavity defined therein and a working fluid contained in the sealed cavity. 
     
     
         7 . The heat-dissipating device of  claim 1 , wherein the fins are made of a material selected from the group consisting of copper, aluminum, stainless steel, and any suitable alloy thereof. 
     
     
         8 . A heat-dissipating device comprising:
 a base, the base having a first surface, a second surface facing away from the first surface, and a metal layer arranged on the second surface, and   a plurality of fins arranged on the first surface, each fin comprising a main body perpendicular to the first surface and an extending portion perpendicularly extending from an end of the main body distal from the first surface.   
     
     
         9 . The heat-dissipating device of  claim 8 , wherein the roughness of the metal layer is smaller than 8 nanometers. 
     
     
         10 . The heat-dissipating device of  claim 9 , wherein each extending portion has a plurality of through holes defined therein. 
     
     
         11 . The heat-dissipating device of  claim 9 , wherein each fin has an L-shaped or T-shaped cross-section. 
     
     
         12 . The heat-dissipating device of  claim 9 , wherein the base comprises a sealed cavity defined therein and a working fluid contained in the sealed cavity. 
     
     
         13 . A heat-dissipating device comprising:
 a base, the base having a first surface, a sealed cavity defined therein, and a working fluid contained in the sealed cavity, and   a plurality of fins arranged on the first surface, each fin comprising a main body perpendicular to the first surface and an extending portion perpendicularly extending from an end of the main body distal from the first surface.   
     
     
         14 . The heat-dissipating device of  claim 13 , wherein each extending portion has a plurality of through holes defined therein. 
     
     
         15 . The heat-dissipating device of  claim 13 , wherein each fin has an L-shaped or T-shaped cross-section. 
     
     
         16 . The heat-dissipating device of  claim 13 , wherein the base comprises a second surface facing away from the first surface and a metal layer arranged on the second surface. 
     
     
         17 . The heat-dissipating device of  claim 16 , wherein the roughness of the metal layer is smaller than 8 nanometers. 
     
     
         18 . The heat-dissipating device of  claim 13 , wherein the fins are made of a material selected from the group consisting of copper, aluminum, stainless steel, and any suitable alloy thereof.