Manufacturing method of probe card

Abstract

A manufacturing method for probe card according to the present invention includes following processes. A film is formed on the surface of a circuit board. A connecting terminal and joint member are formed by etching the film, and the surface of the joint member is polished. An inspection contacting structure is assembled. The inspection contacting structure is moved proximity to a circuit board. The lower surface of a contactor and joint member are attached so as to contact the front end of a probe penetrating and passing through the contactor to the connecting terminal.

1 . A manufacturing method for a probe card having a contacting body and a circuit substrate, the method comprising the steps of:
 preparing the contacting body having a probe for contacting a test object;   forming a connecting terminal and a joint member on the circuit substrate, the connecting terminal communicating an electric signal with the probe;   polishing a surface of the joint member; and   joining the joint member to the contacting body.   
     
     
         2 . The manufacturing method of  claim 1 , wherein the connecting terminal and the joint member are formed simultaneously. 
     
     
         3 . The manufacturing method of  claim 1 , wherein the connecting terminal and the joint member are formed by etching a film formed on the circuit substrate. 
     
     
         4 . The manufacturing method of  claim 3 , wherein the film includes copper (Cu), nickel (Ni) or palladium (Pd). 
     
     
         5 . The manufacturing method of  claim 1 , wherein the connecting terminal and the joint member are formed by the same material. 
     
     
         6 . The manufacturing method of  claim 5 , wherein the material contains copper (Cu), nickel (Ni) or palladium (Pd). 
     
     
         7 . The manufacturing method of  claim 1 , wherein the joint member surrounds the connecting terminal. 
     
     
         8 . The manufacturing method of  claim 1 , further comprising the step of:
 plating the surface of the joint member with metal after polishing the surface and before joining the joint member to the contacting body.   
     
     
         9 . The manufacturing method of  claim 8 , further comprising the step of:
 forming a mask on the connecting terminal exposing the surface of the joint member before plating the surface of the joint member.   
     
     
         10 . The manufacturing method of  claim 1 , wherein the circuit substrate is an organic substrate. 
     
     
         11 . The manufacturing method of  claim 2 , wherein the circuit substrate is an organic substrate. 
     
     
         12 . The manufacturing method of  claim 3 , wherein the circuit substrate is an organic substrate. 
     
     
         13 . The manufacturing method of  claim 4 , wherein the circuit substrate is an organic substrate. 
     
     
         14 . The manufacturing method of  claim 5 , wherein the circuit substrate is an organic substrate. 
     
     
         15 . The manufacturing method of  claim 6 , wherein the circuit substrate is an organic substrate. 
     
     
         16 . The manufacturing method of  claim 7 , wherein the circuit substrate is an organic substrate. 
     
     
         17 . The manufacturing method of  claim 8 , wherein the circuit substrate is an organic substrate. 
     
     
         18 . The manufacturing method of  claim 9 , wherein the circuit substrate is an organic substrate. 
     
     
         19 . The manufacturing method of  claim 1 , wherein the circuit substrate is formed by glass epoxy. 
     
     
         20 . The manufacturing method of  claim 1 , wherein the surface of the joint member is polished by a Chemical Mechanical Polishing method.