US2012137718A1PendingUtilityA1

Cooling apparatus and electronic apparatus

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Assignee: UCHIDA HIROKIPriority: Dec 1, 2010Filed: Sep 22, 2011Published: Jun 7, 2012
Est. expiryDec 1, 2030(~4.4 yrs left)· nominal 20-yr term from priority
Inventors:Hiroki UchidaSusumu OgataSeiji Hibino
H05K 7/20336F28D 15/043
43
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Claims

Abstract

A cooling apparatus includes: an evaporator, including a porous body, a vapor channel and a liquid channel separated by the porous body, to evaporate a working fluid in liquid phase; a condenser to condense the working fluid in vapor phase; a liquid reservoir tank to reserve the working fluid in the liquid phase; a vapor line connecting an outlet of the vapor channel in the evaporator and an inlet of the condenser; a liquid line connecting an outlet of the condenser and a first inlet of the liquid reservoir tank; a liquid supply line connecting an outlet of the liquid reservoir tank and an inlet of the liquid channel in the evaporator; a liquid return line connecting an outlet of the liquid channel in the evaporator and a second inlet of the liquid reservoir tank; and a liquid transport unit interposed in the liquid supply line.

Claims

exact text as granted — not AI-modified
1 . A cooling apparatus comprising:
 an evaporator, comprising a porous body, a vapor channel and a liquid channel separated by the porous body, to evaporate a working fluid in liquid phase;   a condenser to condense the working fluid in vapor phase;   a liquid reservoir tank to reserve the working fluid in the liquid phase;   a vapor line connecting an outlet of the vapor channel in the evaporator and an inlet of the condenser;   a liquid line connecting an outlet of the condenser and a first inlet of the liquid reservoir tank;   a liquid supply line connecting an outlet of the liquid reservoir tank and an inlet of the liquid channel in the evaporator;   a liquid return line connecting an outlet of the liquid channel in the evaporator and a second inlet of the liquid reservoir tank; and   a liquid transport unit interposed in the liquid supply line.   
     
     
         2 . The cooling apparatus according to  claim 1 , wherein the porous body is a porous body formed from a resin. 
     
     
         3 . The cooling apparatus according to  claim 1 , wherein the liquid return line comprises a radiator. 
     
     
         4 . The cooling apparatus according to  claim 1 , further comprising a condensing device comprising the condenser and a cooling unit,
 wherein a portion of the liquid return line is provided inside the condensing device.   
     
     
         5 . The cooling apparatus according to  claim 1 , wherein the second inlet of the liquid reservoir tank is provided farther from the outlet of the liquid reservoir tank than the first inlet. 
     
     
         6 . The cooling apparatus according to  claim 1 , wherein the vapor channel and the liquid channel extend orthogonally from each other. 
     
     
         7 . The cooling apparatus according to  claim 1 , wherein the vapor channel comprises a first vapor channel provided over a top side of the porous body, and a second vapor channel provided over a bottom side of the porous body, and the liquid channel is a liquid channel provided inside the porous body. 
     
     
         8 . The cooling apparatus according to  claim 1 , wherein the vapor channel is a vapor channel provided over one of top and bottom sides of the porous body, and the liquid channel is a liquid channel provided over the other of the top and bottom sides of the porous body. 
     
     
         9 . The cooling apparatus according to  claim 1 , wherein the porous body has an average pore diameter of about 10 μm or less. 
     
     
         10 . An electronic apparatus comprising:
 an electronic component provided over a circuit board; and   a cooling apparatus to cool the electronic component, the cooling apparatus comprising:
 an evaporator, comprising a porous body, a vapor channel and a liquid channel separated by the porous body, to evaporate a working fluid in liquid phase; 
 a condenser to condense the working fluid in vapor phase; 
 a liquid reservoir tank to reserve the working fluid in the liquid phase; 
 a vapor line connecting an outlet of the vapor channel in the evaporator and an inlet of the condenser; 
 a liquid line connecting an outlet of the condenser and a first inlet of the liquid reservoir tank; 
 a liquid supply line connecting an outlet of the liquid reservoir tank and an inlet of the liquid channel in the evaporator; 
 a liquid return line connecting an outlet of the liquid channel in the evaporator and a second inlet of the liquid reservoir tank; and 
 a liquid transport unit interposed in the liquid supply line, 
   wherein the electronic component is thermally connected to the evaporator.   
     
     
         11 . The electronic apparatus according to  claim 10 , wherein the porous body is a porous body formed from a resin. 
     
     
         12 . The electronic apparatus according to  claim 10 , wherein the liquid return line comprises a radiator. 
     
     
         13 . The electronic apparatus according to  claim 10 , further comprising a condensing device comprising the condenser and a cooling unit,
 wherein a portion of the liquid return line is provided inside the condensing device.   
     
     
         14 . The electronic apparatus according to  claim 10 , wherein the second inlet of the liquid reservoir tank is provided farther from the outlet of the liquid reservoir tank than the first inlet. 
     
     
         15 . The electronic apparatus according to  claim 10 , wherein the vapor channel comprises a first vapor channel provided over a top side of the porous body, and a second vapor channel provided over a bottom side of the porous body, and the liquid channel is a liquid channel provided inside the porous body. 
     
     
         16 . The electronic apparatus according to  claim 15 , wherein the electronic component comprises a first electronic component thermally connected to a top side of the evaporator, and a second electronic component thermally connected to a bottom side of the evaporator. 
     
     
         17 . The electronic apparatus according to  claim 10 , wherein the vapor channel is provided over one of top and bottom sides of the porous body, and the liquid channel is provided over the other of the top and bottom sides of the porous body. 
     
     
         18 . The electronic apparatus according to  claim 17 , wherein the electronic component is thermally connected to the side where the vapor channel in the evaporator is provided. 
     
     
         19 . The electronic apparatus according to  claim 10 , wherein the evaporator comprises:
 a first evaporator comprising a fist porous body, a first vapor channel provided over one of top and bottom sides of the first porous body, and a first liquid channel provided over the other of the top and bottom sides of the first porous body; and   a second evaporator comprising a second porous body, a second vapor channel provided over one of top and bottom sides of the second porous body, and a second liquid channel provided over the other of the top and bottom sides of the second porous body,   wherein the side where the vapor channel in the first evaporator is provided is thermally connected to a back face side of the electronic component, and the side where the vapor channel in the second evaporator is provided is thermally connected to a front face side of the electronic component.   
     
     
         20 . The electronic apparatus according to  claim 10 , wherein the porous body has an average pore diameter of about 10 μm or less.

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