US2012160166A1PendingUtilityA1

Reliant Thermal Barrier Coating System and Related Apparatus and Methods of Making the Same

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Assignee: HASS DEREK DPriority: Jun 30, 2005Filed: Dec 25, 2011Published: Jun 28, 2012
Est. expiryJun 30, 2025(expired)· nominal 20-yr term from priority
C23C 14/024C23C 14/325C23C 14/228C23C 14/0021Y02T50/60C23C 14/08C23C 14/30
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Claims

Abstract

A method and apparatus for forming a thermal barrier coating system in communication with at least a portion of at least one substrate. The method includes: depositing a first bond coat on at least a portion of at least one substrate; depositing a first thermal barrier coat disposed on the bond coat; whereby the deposition occurs in one or more chambers to form the thermal barrier coating system; and wherein the deposition of the first bond coat (or subsequent bond coats) and the deposition of the first thermal barrier coat (or subsequent thermal barrier coats) is performed without out-of chamber handling of the thermal barrier coating system.

Claims

exact text as granted — not AI-modified
1 . An apparatus forming a thermal barrier coating system in communication with at least a portion of at least one substrate, said apparatus comprising:
 a directed vapor deposition (DVD) apparatus, an evaporation (thermal, RF, laser, or electron beam) apparatus, a reactive evaporation apparatus, a sputtering (DC, RF, microwave and/or magnetron) apparatus, a reactive sputtering apparatus, an electron beam physical vapor deposition (EF-PVD) apparatus, an ion plasma deposition (IPD) apparatus, a low pressure plasma spray (LPPS) apparatus, a high velocity oxy-fuel (HVOF) apparatus, a vapor deposition apparatus, a cluster deposition apparatus, a cathodic arc deposition apparatus, or a jet vapor deposition apparatus, or any combination thereof, wherein said apparatus for forming said thermal barrier coating system is adapted to:   deposit a first bond coat on at least a portion of said substrate; and   deposit a first thermal barrier coat on said bond coat   
     
     
         2 . An apparatus for forming a thermal barrier coating system in communication with at least a portion of at least one substrate, said apparatus comprising:
 a directed vapor deposition (DVD) apparatus, wherein said apparatus for forming said thermal barrier coating system is adapted to:   deposit a first bond coat on at least a portion of said substrate; and   deposit a first thermal barrier coat on said first bond coat.   
     
     
         3 . An apparatus for forming a thermal barrier coating system in communication with at least a portion of at least one substrate, said apparatus being adapted to:
 deposit a first bond coat on at least a portion of at least one said substrate;   deposit a first thermal barrier coat disposed on said bond coat; and   wherein said apparatus being adapted whereby said bond coat and said thermal barrier coat are deposited without exposing said thermal barrier coating system to atmospheric conditions.   
     
     
         4 . An apparatus for forming a thermal barrier coating system in communication with at least a portion of at least one substrate, said apparatus being adapted to:
 deposit a first bond coat on at least a portion of at least one said substrate;   deposit a first thermal barrier coat on said first bond coat; and   comprising one or more chambers, wherein said deposition occurs in said one or more chambers to form said thermal barrier coating system; wherein:   said deposition of said first bond coat and said deposition of said first thermal barrier coat is performed without out-of-chamber handling of said thermal barrier coating system.   
     
     
         5 . The thermal barrier coating system of  claim 1 , wherein said apparatus for forming said thermal barrier coating system is further adapted to deposit a second bond coat on said thermal barrier layer, said second bond coat comprising a sealant layer. 
     
     
         6 . The thermal barrier coating system of  claim 5 , further comprising:
 a second thermal barrier coat on said second bond coat.   
     
     
         7 . The thermal barrier coating system of  claim 6 , wherein said properties of said first bond coat and/or first thermal barrier coat have the same material properties as said second bond coat and/or second thermal barrier coat, respectively. 
     
     
         8 . The thermal barrier coating system of  claim 6 , wherein said properties of said first bond coat and/or first thermal barrier coat have different material properties as said second bond coat and/or second thermal barrier coat, respectively. 
     
     
         9 . The thermal barrier coating system of  claim 6 , further comprising:
 one or more additional alternating layers of bond coat and thermal barrier coat to said second thermal barrier coat.   
     
     
         10 . The thermal barrier coating system of  claim 9 , wherein said properties of said first bond coat and/or first thermal barrier coat, said second bond coat and/or second thermal barrier bond coat, and/or said additional bond coat and/or additional thermal barrier coat have the same material properties for respective bond coat and thermal barrier coat layers. 
     
     
         11 . The thermal barrier coating system of  claim 9 , wherein said properties of said first bond coat and/or first thermal barrier coat, said second bond coat and/or second thermal barrier bond coat, and/or said additional bond coat and/or additional thermal barrier coat have different material properties for respective bond coat and thermal barrier coat layers.

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