Method and apparatus for chip cooling

Abstract

In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.

1 . An apparatus for cooling a heat-generating device, comprising:
 a compressible fluid compressed to a pressure in a range from approximately 50 to approximately 250 psi; and   means for adiabatically expanding said fluid, said expanded fluid being in thermal contact with said heat-generating device.   
     
     
         2 . The apparatus of  claim 1 , wherein the fluid is a gas or a liquid. 
     
     
         3 . The apparatus of  claim 1 , wherein the fluid is a liquid that can be easily expanded to a gas and then easily removed from the apparatus and recompressed into a liquid. 
     
     
         4 . The apparatus of  claim 1 , wherein the means for adiabatically expanding the fluid is manifold, the manifold comprising a plurality of apertures formed therein for impinging the fluid on the heat-generating device.