Heat dissipation device

Abstract

A heat dissipation device for dissipating heat from an electronic component, includes a heat sink, a centrifugal fan disposed on the heat sink, and a cover board covering the heat sink and located above the centrifugal fan. The cover board defines a plurality of through holes acting as air-intakes of the centrifugal fan.

1 . A heat dissipation device comprising:
 a heat sink;   a centrifugal fan disposed on the heat sink; and   a cover board covering the heat sink and located above the centrifugal fan; wherein   the cover board defines a plurality of through holes acting as air-intakes of the centrifugal fan.   
     
     
         2 . The heat dissipation device of  claim 1 , wherein the heat sink comprises a base and a plurality of fins extending upwardly from a top face of the base. 
     
     
         3 . The heat dissipation device of  claim 2 , wherein a receiving portion is defined by the top face of the base and inner circumferential peripheries of the fins. 
     
     
         4 . The heat dissipation device of  claim 3 , wherein the fan is received in the receiving portion. 
     
     
         5 . The heat dissipation device of  claim 4 , wherein a height of the centrifugal fan is less than that of each fin of the heat sink. 
     
     
         6 . The heat dissipation device of  claim 3 , wherein the fins are arranged radially relative to the receiving portion. 
     
     
         7 . The heat dissipation device of  claim 2 , wherein the fins are spaced from each other, and a passage is defined between every two neighboring fins. 
     
     
         8 . The heat dissipation device of  claim 7 , wherein airflow generated by the centrifugal fan directly flow through the passages of the fins. 
     
     
         9 . The heat dissipation device of  claim 1 , wherein the centrifugal fan comprises a rotation axis, a magnetic member mounted on the rotation axis, a mounting ring, and an impeller rotatably engaging with the rotation axis. 
     
     
         10 . The heat dissipation device of  claim 9 , wherein the rotation axis is perpendicular to the base of the heat sink. 
     
     
         11 . The heat dissipation device of  claim 1 , wherein the through holes are located above the centrifugal fan. 
     
     
         12 . The heat dissipation device of  claim 1 , wherein the through holes are spaced from each other. 
     
     
         13 . The heat dissipation device of  claim 1 , wherein the through holes are arranged radially relative to a center of the cover board. 
     
     
         14 . The heat dissipation device of  claim 1 , wherein a circular hole is defined at a center of the cover board. 
     
     
         15 . The heat dissipation device of  claim 1 , wherein the cover board is attached to a top side of the heat sink.