Local Thermal Management

Abstract

An apparatus and a method for thermal management of a component in a first region, wherein an interconnector connects the component thermally to a second heat region, wherein a thermally conducting heat shield encloses the interconnector from a position within the first region in close proximity to the component to the second region, and that at least one heat unit is thermally connected to the interconnector within the second region. The heat units may be heat sources and/or heat sinks, and the invention may manage the component at a higher or lower temperature than the surrounding first region. When heat enters the heat shield from a hot surrounding first region, e.g. hot gas, the heat shield conducts heat more efficiently than the medium encapsulated by the heat shield. Thus, the heat tends to follow the path provided by the heat shield. Areas of use include providing efficient particle deposition by thermophoresis or heat a component in a cold environment.

1 . An apparatus for thermal management of a component in a first region, wherein an interconnector connects the component thermally to a second heat region, wherein
 a thermally conducting heat shield encloses the interconnector from a position within the first region in close proximity to the component to the second region, defining a cavity between the interconnector and the heat shield, and   at least one heat unit is thermally connected to at least one of the heat shield and the interconnector within the second region.   
     
     
         2 . The apparatus of  claim 1 , wherein at least one heat unit is a heat sink. 
     
     
         3 . The apparatus of  claim 1 , wherein at least one heat unit is a heat source. 
     
     
         4 . The apparatus of  claim 1 , wherein an interior of the heat shield is in fluid communication with the second region. 
     
     
         5 . The apparatus of  claim 1 , further comprising means for circulating fluid in the cavity between the heat shield and the interconnector, whereby heat is removed from the cavity. 
     
     
         6 . The apparatus of  claim 1 , wherein the heat shield has a thermal conductivity greater than a thermal conductivity of a medium inside the heat shield. 
     
     
         7 . The apparatus of  claim 1 , further comprising a reflective surface on at least one of the interconnector and the heat shield. 
     
     
         8 . A method for thermal management of a component in a first region, wherein an interconnector connects the component thermally to a second heat region, comprising
 providing a second heat path enclosing the first heat path from a position within the first region in close proximity to the thermally managed component to the second region, defining a cavity between the second heat path and first heat path, and by   providing a thermal connection between at least one of the first heat path and the second heat path to at least one heat unit within the second region.   
     
     
         9 . The method of  claim 8 , further comprising circulating a fluid in the cavity between the first and second heat paths. 
     
     
         10 . The method of  claim 8 , further comprising minimizing heat transfer between the heat paths. 
     
     
         11 . The method of  claim 8 , further comprising managing the temperature of at least one heat unit.