US2012161258A1PendingUtilityA1

Package with a cmos die positioned underneath a mems die

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Assignee: LOEPPERT PETER VPriority: Dec 28, 2010Filed: Dec 28, 2010Published: Jun 28, 2012
Est. expiryDec 28, 2030(~4.5 yrs left)· nominal 20-yr term from priority
Inventors:Peter V. LoeppertJeffery NiewAnthony D. MinerviniDaniel Giesecke
H10W 90/759H10W 90/758H10W 90/754H10W 90/753H10W 90/724H10W 70/681H10W 72/5363H10W 72/536H10W 72/932H10W 90/00H04R 19/04H04R 19/005H04R 2499/11H04R 31/00
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Claims

Abstract

A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate.

Claims

exact text as granted — not AI-modified
1 . A package comprising:
 a substrate;   a cover;   a MEMS die located on the substrate;   a CMOS die located underneath the MEMS die having a volume;   an acoustic port in the package, wherein the package has a back volume located between the MEMS die and the substrate;   wherein an effective back volume exists which is equal to the back volume minus the volume of the CMOS die.   
     
     
         2 . The package of  claim 1  wherein the acoustic port is in the cover. 
     
     
         3 . The package of  claim 1  wherein the acoustic port is in the substrate. 
     
     
         4 . The package of  claim 1  further comprising:
 a channel created within the MEMS die wherein the CMOS die is partially nested underneath the MEMS die. 
 
     
     
         5 . A package comprising:
 a substrate;   a cover;   a MEMS die located on the substrate;   a CMOS die located underneath the MEMS die having a volume;   an acoustic port in the package, wherein the package has a front volume located between the MEMS die and the substrate;   wherein an effective front volume exists which is equal to the front volume minus the volume of the CMOS die.   
     
     
         6 . The package of  claim 5  wherein the acoustic port is in the substrate. 
     
     
         7 . The package of  claim 5  wherein the acoustic port is positioned adjacent to the CMOS die. 
     
     
         8 . A package comprising:
 a substrate;   a cover;   a MEMS die having sidewalls and a diaphragm connected to the sidewalls;   a CMOS die positioned on the substrate, underneath the MEMS die and surrounded by the sidewalls of the MEMS die.   
     
     
         9 . The package of  claim 8  further comprising:
 an acoustic port within the cover. 
 
     
     
         10 . The package of  claim 8  further comprising:
 an acoustic port within the substrate. 
 
     
     
         11 . A package comprising:
 a substrate;   a cover;   a MEMS die having sidewalls and a diaphragm connected to the sidewalls;   a CMOS die positioned on the substrate, partially underneath the MEMS die and through a channel in a sidewall of the MEMS die.   
     
     
         12 . The package of  claim 11  further comprising:
 a sealant enclosing a portion of the CMOS die which is positioned exterior to the MEMS die. 
 
     
     
         13 . The package of  claim 11  further comprising:
 an acoustic port within the substrate. 
 
     
     
         14 . The package of  claim 11  further comprising:
 an acoustic port within the cover. 
 
     
     
         15 . A package comprising:
 a substrate;   a cover;   a MEMS die having a diaphragm;   a CMOS die wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate.   
     
     
         16 . The package of  claim 15  wherein the CMOS die is contained within sidewalls of the MEMS die. 
     
     
         17 . The package of  claim 15  wherein the CMOS die extends through a channel in the MEMS die. 
     
     
         18 . The package of  claim 17  further comprising:
 a sealant enclosing a portion of the CMOS die which extends exterior to the MEMS die. 
 
     
     
         19 . The package of  claim 15  further comprising:
 an acoustic port within the substrate. 
 
     
     
         20 . The package of  claim 15  further comprising:
 an acoustic port within the cover.

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