US2012164334A1PendingUtilityA1
Article treated with silica particles and method for treating a surface of the article
Est. expiryAug 26, 2028(~2.1 yrs left)· nominal 20-yr term from priority
Inventors:Jin Kyu Lee
C08J 7/0423B05D 2202/25B05D 2451/00Y10T428/259Y10T428/25Y10T428/265B05D 3/002B05D 3/0218B05D 2601/22Y10T428/31663C08J 7/043
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Claims
Abstract
An article including a substrate, and a base layer formed on a surface of the substrate, and methods for treating the surface of the substrate are provided.
Claims
exact text as granted — not AI-modified1 . A method for treating a surface of a substrate, comprising:
coating a surface of a substrate with a dispersion liquid containing silica particles; drying the substrate coated with the dispersion liquid to form a base layer on the surface of the substrate; and applying a coating layer on the base layer.
2 . The method of claim 1 , wherein an average size of the silica particles is about 1 μm or less.
3 . The method of claim 1 , wherein the silica particles are porous.
4 . The method of claim 1 , wherein about 95% or more of the silica particles have a size of about 40% to about 160% of an average particle size of the silica particles.
5 . The method of claim 1 , wherein the dispersion liquid comprises water, an organic liquid, or a mixture thereof.
6 . The method of claim 1 , wherein the method repeats the following one or more times:
coating a surface of a substrate with the dispersion liquid containing silica particles; and drying the substrate coated with the dispersion liquid to form a base layer on the surface of the substrate.
7 . The method of claim 1 , wherein the method further comprises heat-treating the substrate on which the base layer is formed.
8 . The method of claim 7 , wherein the heat-treating is carried out at a temperature ranging from about 50° C. to about 900° C.
9 . The method of claim 1 , wherein the substrate comprises a material selected from the group consisting of metals, glass, ceramics, vinyl, masonry, concrete, natural stones, artificial stones and plastics.
10 . The method of claim 1 , wherein the method further comprises removing impurities present on the surface of the substrate before coating the surface of the substrate with the dispersion liquid.
11 . The method of claim 1 , wherein the coating layer comprises paint.
12 . A method for treating a surface of a metal substrate, comprising:
coating a surface of a metal substrate with a dispersion liquid containing silica particles; drying the metal substrate coated with the dispersion liquid to form a base layer on the surface of the metal substrate; heat-treating the metal substrate on which the base layer is formed; and applying a coating layer to the base layer.
13 . The method of claim 12 , wherein about 95% or more of total silica particles have a size of about 40% to about 160% of an average particle size of the silica particles.
14 . The method of claim 12 , wherein heat-treating the metal substrate comprises heating the metal substrate at a temperature ranging from about 50° C. to about 900° C.
15 . The method of claim 12 , wherein an average size of the silica particles is about 20 nm to about 1 μm.
16 . A method for treating substrate comprising:
dispersing silica particles in a solvent to form a liquid dispersion, wherein the solvent comprises water, an organic liquid, or combinations thereof; applying the liquid dispersion to a substrate; and removing at least a portion of the solvent from the liquid dispersion applied to the substrate to form a base layer on the substrate, wherein the base layer comprises at least a portion of the silica particles; and heating the base layer at a temperature ranging from about 50° C. to about 900° C.
17 . The method of claim 16 , further comprising applying a coating layer to a side of the base layer opposite the substrate, wherein the base layer improves adhesion between the substrate and the coating layer.
18 . The method of claim 16 , wherein an average size of the silica particles is about 20 nm to about 1 μm.
19 . The method of claim 16 , wherein the base layer has a thickness less than 1 μm.
20 . The method of claim 16 , wherein the substrate comprises a metal.Cited by (0)
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