Active resin composition, surface mounting method and printed wiring board

Abstract

A surface mounting method includes applying an active resin composition to at least part of a surface of a printed wiring substrate; mounting a surface mount device on the substrate; performing reflow soldering; applying an under-filling resin into a space of interest; before and/or after applying the under-filling resin, performing a vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of any of the applied active resin composition and the under-filling resin; and subsequently, thermally curing the resin composition and the under-filling resin. The active resin composition contains an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1-50 parts by weight and/or a carboxylic acid compound in an amount of 1-10 parts by weight, and a curing agent which can initiate curing reaction at 150° C. or higher, in an amount of 1-30 parts by weight.

1 . An active resin composition comprising an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1 to 50 parts by weight and/or a carboxylic acid compound in an amount of 1 to 10 parts by weight, and a curing agent which can initiate curing reaction at 150° C. or higher, in an amount of 1 to 30 parts by weight. 
     
     
         2 . A surface mounting method comprising:
 applying an active resin composition as recited in  claim 1  to at least a part of a surface of a printed wiring substrate;   mounting a surface mount device on the printed wiring substrate;   performing reflow soldering;   performing a vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of the applied active resin composition; and   subsequently, thermally curing the applied resin composition.   
     
     
         3 . A surface mounting method comprising:
 applying an active resin composition as recited in  claim 1  to at least a part of a surface of a printed wiring substrate;   mounting a surface mount device on the printed wiring substrate;   performing reflow soldering;   putting an under-filling resin into a space of interest;   before and/or after putting in the under-filling resin, performing a vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of any of the applied active resin composition and the under-filling resin; and   subsequently, thermally curing the applied active resin composition and the under-filling resin.   
     
     
         4 . A surface mounting method according to  claim 2 , wherein the active resin composition is applied to at least a part of a metallic surface of the printed wiring substrate. 
     
     
         5 . A surface mounting method according to  claim 3 , wherein the active resin composition is applied to at least a part of a metallic surface of the printed wiring substrate. 
     
     
         6 . A surface mounting method according to  claim 2 , wherein, before mounting the surface mount device on the printed wiring substrate, there is performed drying the applied resin composition and/or heating at a temperature which is equal to or higher than the softening temperature of the applied resin composition and which is lower than the curing reaction-initiating temperature. 
     
     
         7 . A surface mounting method according to  claim 3 , wherein, before mounting the surface mount device on the printed wiring substrate, there is performed drying the applied resin composition and/or heating at a temperature which is equal to or higher than the softening temperature of the applied resin composition and which is lower than the curing reaction-initiating temperature. 
     
     
         8 . A surface mounting method according to  claim 4 , wherein, before mounting the surface mount device on the printed wiring substrate, there is performed drying the applied resin composition and/or heating at a temperature which is equal to or higher than the softening temperature of the applied resin composition and which is lower than the curing reaction-initiating temperature. 
     
     
         9 . A surface mounting method according to  claim 5 , wherein, before mounting the surface mount device on the printed wiring substrate, there is performed drying the applied resin composition and/or heating at a temperature which is equal to or higher than the softening temperature of the applied resin composition and which is lower than the curing reaction-initiating temperature. 
     
     
         10 . A printed wiring board produced through a surface mounting method as recited in  claim 2 . 
     
     
         11 . A printed wiring board produced through a surface mounting method as recited in  claim 3 . 
     
     
         12 . A printed wiring board produced through a surface mounting method as recited in  claim 4 . 
     
     
         13 . A printed wiring board produced through a surface mounting method as recited in  claim 5 . 
     
     
         14 . A printed wiring board produced through a surface mounting method as recited in  claim 6 . 
     
     
         15 . A printed wiring board produced through a surface mounting method as recited in  claim 7 . 
     
     
         16 . A printed wiring board produced through a surface mounting method as recited in  claim 8 . 
     
     
         17 . A printed wiring board produced through a surface mounting method as recited in  claim 9 .