US2012174740A1PendingUtilityA1
Methods of Making and Using Reactive Shaped Charge Shock Initiation Devices Including Reactive Multilayer Structures
Est. expiryMay 27, 2023(expired)· nominal 20-yr term from priority
F42B 12/06C06B 45/14F42B 1/032F42B 39/00F42B 12/76
43
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
The invention provides shock initiation devices comprising multilayer structures with constituent layers that undergo an exothermic self-propagating reaction once initiated by shock. The multilayer structures may be used as components in shaped charges, EFP devices, warheads, munition casings, interceptors, missiles, bombs, and other systems. The reactive layer materials may be selected based on required structural properties, density and reaction temperature.
Claims
exact text as granted — not AI-modified1 : A method of making a shaped charge shock initiation device comprising:
depositing layers of reactive materials onto a substrate to form a reactive multilayer structure comprising layers which are capable of subsequently reacting with each other; and incorporating the reactive multilayer structure in a reactive shaped charge shock initiation device.
2 : The method of claim 1 , wherein the deposition process comprises magnetron physical vapor deposition, electron-beam physical vapor deposition or chemical vapor deposition.
3 : The method of claim 1 , further comprising removing the reactive multilayer structure from the substrate.
4 : The method of claim 1 , wherein the substrate comprises a mandrel.
5 : The method of claim 1 , wherein the reactive materials are deposited on the substrate at a rate of at least 0.01 mm per hour.
6 : The method of claim 1 , wherein each of the layers has a thickness of from about 1 micron to about 5 mm.
7 : The method of claim 1 , wherein the layers of reactive materials are directly adjacent each other.
8 : The method of claim 1 , further comprising forming an interdiffusion zone between adjacent reactive material layers.
9 : The method of claim 8 , wherein the interdiffusion zone inhibits reaction between the reactive material layers when the multilayer structure is subjected to a localized heat source.
10 : The method of claim 8 , wherein the interdiffusion zone has a thickness sufficient to prevent reaction between the reactive material layers when the multilayer structure is subjected to a localized heat source.
11 : The method of claim 1 , wherein the reactive material layers are separated from each other.
12 : The method of claim 11 , wherein the reactive material layers are separated by at least one layer of inert material.
13 : A method of reacting a multilayer shaped charge structure comprising:
forming a reactive multilayer shaped charge structure comprising repeating layers of reactive components which are capable of subsequently reacting with each other; and initiating reaction of the reactive components by subjecting the components to shock.
14 : The method of claim 13 , wherein the shock is provided by an explosive.
15 : The method of claim 13 , wherein the shock is provided by impact of the device with an object.
16 : The method of claim 13 , further comprising dispersing the components.
17 : The method of claim 16 , wherein the components are dispersed after they are subjected to the shock.
18 : The method of claim 16 , wherein the components are dispersed in a pattern.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.