Apparatus for plating flexible printed circuit board

Abstract

A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material.

1 . A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region, the plating apparatus comprising:
 a plating bath comprising a tank extending along a lengthwise direction of the FPCB base board; and   a shielding apparatus comprising a first shielding plate and a second shielding plate, the first shielding plate spatially corresponding to the first conveyance region, a distance between the first shielding plate and the first conveyance region being in a range from 5 millimeters to 20 millimeters, a width of the first shielding plate being equal to or larger than a width of the first conveyance region, the second shielding plate spatially corresponding to the second conveyance region, a distance between the second shielding plate and the second conveyance region being in a range from 5 millimeters to 20 millimeters, a width of the second shielding plate being equal to or larger than a width of the second conveyance region, the first shielding plate and the second shielding plate being made of an insulation material.   
     
     
         2 . The plating apparatus as claimed in  claim 1 , wherein the FPCB base board to be process comprises a third conveyance region and a fourth conveyance region, the third conveyance region and the fourth conveyance region located between the first conveyance region and the second conveyance region, the first and third conveyance regions cooperate to delimit a region of one FPCB unit along a width direction of the FPCB base board, the second and fourth conveyance regions cooperate to delimit a region of another FPCB unit along a width direction of the FPCB base board, the shielding apparatus further comprises a third shielding plate spatially corresponding to the adjacent third and fourth conveyance regions, a distance between the third shielding plate and the adjacent third and fourth conveyance regions is in a range from 5 millimeters to 20 millimeters, a width of the third shielding plate is equal to or larger than a sum of the width of the third and fourth conveyance regions, and the third shielding plate is made of an insulation material. 
     
     
         3 . The plating apparatus as claimed in  claim 1 , wherein the insulation material is selected from a group consisting of polyimide, polyvinyl chloride and polypropylene. 
     
     
         4 . The plating apparatus as claimed in  claim 2 , wherein the insulation material is selected from a group consisting of polyimide, polyvinyl chloride and polypropylene. 
     
     
         5 . The plating apparatus as claimed in  claim 1 , wherein the plating apparatus further comprises a supporting pole for transversely connecting the first and second shielding plates. 
     
     
         6 . The plating apparatus as claimed in  claim 2 , wherein the plating apparatus further comprises a supporting pole for transversely connecting the first, second and third shielding plates. 
     
     
         7 . The plating apparatus as claimed in  claim 1 , wherein the first shielding apparatus is positioned in the tank. 
     
     
         8 . The plating apparatus as claimed in  claim 7 , wherein the plating bath further comprises an anode disposed on an inner wall of the tank, and the anode extends along a lengthwise direction of the tank.