Led light disposed on a flexible substrate and connected with a printed 3d conductor

Abstract

An example includes subject matter (such as an apparatus) comprising a planar substrate including a first surface that is planar, at least one bare light emitting diode (“LED”) die coupled to the substrate and conductive ink electrically coupling the at least one bare LED die, wherein the conductive ink is disposed on the substrate and extends onto a surface of the LED that is out-of-plane from the first surface.

1 . An apparatus, comprising:
 a planar substrate including a first surface that is planar;   at least one bare light emitting diode (“LED”) die coupled to the first surface, the at least one bare LED die comprising:
 a planar N-doped region located substantially parallel to the planar substrate and facing away from the planar substrate; and 
 a P-doped region defining a mesa-shaped section facing away from the planar substrate, the P-doped region disposed parallel the N-doped region, further away from the planar substrate than the N-doped region; and 
   an insulator disposed between the N-doped region and the planar substrate, along a portion of the at least one bare LED die, from a side of the mesa, along the N-doped region, and onto a side of the N-doped region.   
     
     
         2 . The apparatus of  claim 1 , wherein the insulator contacts a surface of a bare LED die that is substantially perpendicular to first surface. 
     
     
         3 . The apparatus of  claim 1 , wherein a conductive ink is disposed over an edge of the bare LED die, onto two non planar sides of the bare LED die. 
     
     
         4 . The apparatus of  claim 1 , wherein the insulator comprises non-conductive ink. 
     
     
         5 . The apparatus of  claim 1 , wherein the at least one bare LED die is electrically coupled with the conductive ink. 
     
     
         6 . The apparatus of  claim 3 , wherein the conductive ink is disposed on the planar substrate and extends onto a surface of the bare LED die that is in a different plane than the planar substrate. 
     
     
         7 . An apparatus, comprising:
 a planar substrate including a first surface that is planar;   at least one bare light emitting diode (“LED”) die coupled to the planar substrate, the at least one bare LED die comprising:
 an N-doped region; and 
 a P-doped region defining a mesa-shaped section on disposed further away from the planar substrate than the N-doped region; 
   an insulative chip substrate disposed between the N-doped region and the planar substrate; and   conductive ink electrically connected to the at least one bare LED die, wherein the conductive ink is disposed on the planar substrate and extends onto a surface of the LED that is out-of-plane from the first surface of the planar substrate.   
     
     
         8 . The apparatus of  claim 7 , wherein the conductive ink includes nanoparticle-ink. 
     
     
         9 . The apparatus of  claim 8 , wherein the nanoparticle-ink comprises silver. 
     
     
         10 . The apparatus of  claim 7 , wherein the planar substrate is flexible. 
     
     
         11 . The apparatus of  claim 7 , wherein the conductive ink is disposed on the planar substrate and the surface of the LED die with an aerosol jet printer. 
     
     
         12 . A method, comprising:
 placing at least one bare LED die on a planar substrate having a major face; and   printing conductive ink on the planar substrate and at least one bare LED with an aerosol jet printer to dispose the conductive ink onto the planar surface, a leading side of the at least one bare LED die that extends along a first side plane that intersects the major face, a top of the at least one bare LED die, and a trailing surface of the at least one bare LED die that extends along a second side plane that intersects the major face.   
     
     
         13 . The method of  claim 12 , wherein the head of the aerosol jet printer is at a 45° angle with respect to a plane of the planar substrate, and the first and second side planes are substantially parallel, perpendicular with the top and the major face. 
     
     
         14 . The method of  claim 13 , wherein the printing conductive ink includes printing a nanoparticle ink. 
     
     
         15 . The method of  claim 14 , wherein printing includes heating the nanoparticle-ink. 
     
     
         16 . The method of  claim 12 , comprising disposing a glop-top onto the bare LED die. 
     
     
         17 . The method of  claim 16 , wherein disposing a glop-top includes disposing the glop-top to cover more than one bare LED die. 
     
     
         18 . The method of  claim 16 , comprising disposing a second planar substrate onto the glop-top. 
     
     
         19 . The method of  claim 18 , wherein the second planar substrate is at least partially transparent. 
     
     
         20 . The method of  claim 12 , disposing an insulator onto the at least one bare LED die, alongside a mesa, to cover an N-doped portion of the bare LED die.