US2012175670A1PendingUtilityA1

Light emitting element, method for manufacturing light emitting element, light emitting element assembly, and method for manufacturing light emitting element assembly

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Assignee: MASUI YUJIPriority: Jan 19, 2007Filed: Mar 20, 2012Published: Jul 12, 2012
Est. expiryJan 19, 2027(~0.5 yrs left)· nominal 20-yr term from priority
H10H 20/8162H01S 5/18338H01S 5/18311
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Claims

Abstract

A method for manufacturing a light emitting element including the steps of (A) sequentially forming on a substrate a first compound semiconductor layer having a first conduction type, an active layer, and a second compound semiconductor layer having a second conduction type; (B) forming a plurality of point-like hole portions in a thickness direction in at least a region of the second compound semiconductor layer located outside a region to be provided with a current confinement region; and (C) forming an insulating region by subjecting a part of the second compound semiconductor layer to an insulation treatment from side walls of the hole portions so as to produce the current confinement region surrounded by the insulating region in the second compound semiconductor layer.

Claims

exact text as granted — not AI-modified
1 . A light emitting element produced by
 (A) sequentially forming on a substrate a first compound semiconductor layer having a first conduction type,   an active layer, and a second compound semiconductor layer having a second conduction type;   (B) forming a plurality of point-like hole portions in a thickness direction in at least a region of the second compound semiconductor layer located outside a region to be provided with a current confinement region;   (C) forming an insulating region by subjecting a part of the second compound semiconductor layer to an insulation treatment from side walls of the hole portions so as to produce the current confinement region surrounded by the insulating region in the second compound semiconductor layer;   (D) removing at least a part of the second compound semiconductor layer and the active layer selectively so as to expose a part of the first compound semiconductor layer and produce a mesa structure including at least the remaining second compound semiconductor layer and active layer; and   (E) forming a first electrode connected to the first compound semiconductor layer, and forming a second electrode at a part of the top surface of the second compound semiconductor layer.   
     
     
         2 . A light emitting element assembly produced by:
 (A) sequentially forming on a substrate a first compound semiconductor layer having a first conduction type,   an active layer, and a second compound semiconductor layer having a second conduction type;   (B) forming a plurality of point-like hole portions in a thickness direction in at least a region of the second compound semiconductor layer located outside each region to be provided with K 0  discrete current confinement regions having different sizes (where K 0  represents an integer of two or more) in each region to be provided with a light emitting element assembly;   (C) forming an insulating region by subjecting a part of the second compound semiconductor layer to an insulation treatment from side walls of the hole portions so as to produce the current confinement region surrounded by K 0  insulating regions in a part of the second compound semiconductor layer;   (D) removing at least a part of the second compound semiconductor layer and the active layer selectively so as to expose a part of the first compound semiconductor layer and produce K 1  mesa structures (where K 1  represents an integer of one or more, and K 1 <K 0 ) including at least the remaining second compound semiconductor layer and active layer in order to form K 1  light emitting elements in each region to be provided with a light emitting element assembly;   (E) forming a first electrode connected to the first compound semiconductor layer, and forming a second electrode at a part of the top surface of the second compound semiconductor layer in each of K 1  mesa structures in each region to be provided with a light emitting element assembly; and   (F) separating each region to be provided with a light emitting element assembly.   
     
     
         3 . The light emitting element assembly according to  claim 2 , wherein the value of K 1  is one. 
     
     
         4 . The light emitting element assembly according to  claim 2 , wherein the value of K 1  is an integer of two or more.

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