Photocurable composition and method for producing molded product with fine pattern

Abstract

To provide a photocurable composition from which a cured product excellent in mold release characteristics and mechanical strength can be obtained, and a method for producing a molded product excellent in durability, with a fine pattern having a reverse pattern of a mold precisely transferred on its surface. A photocurable composition 20 comprising from 15 to 60 mass % of a compound (A) which is an aromatic compound having at least two rings or an alicyclic compound having at least two rings and which has two (meth)acryloyloxy groups, from 5 to 40 mass % of a compound (B) having a fluorine atom and having at least one carbon-carbon unsaturated double bond (excluding the compound (A)), from 10 to 55 mass % of a compound (C) having one (meth)acryloyloxy group (excluding the compound (B)) and from 1 to 12 mass % of a photopolymerization initiator (D) (provided that (A)+(B)+(C)+(D)=100 mass %) is used.

1 - 10 . (canceled) 
     
     
         11 . A method for producing a resist having a surface with a fine pattern, which comprises:
 contacting a photocurable composition with a surface of a mold having a pattern reverse of the fine pattern, wherein the photocurable composition comprises:
 a compound (A) which is an aromatic compound having at least two rings or an alicyclic compound having at least two rings and which has two (meth)acryloyloxy groups, 
 a compound (B) having a fluorine atom and having at least one carbon-carbon unsaturated double bond excluding the compound (A), 
 a compound (C) having one (meth)acryloyloxy group excluding the compound (B) and a photopolymerization initiator (D), 
 wherein the amount of the compound (A) is from 15 to 60 mass %, the amount of the compound (B) is from 5 to 40 mass %, the amount of the compound (C) is from 10 to 55 mass %, and the amount of the photopolymerization initiator (D) is from 1 to 12 mass % based on the total amount 100 mass % of the compound (A), the compound (B), the compound (C) and the photopolymerization initiator (D); 
   irradiating the photocurable composition with light while the photocurable composition is in contact with the surface having the pattern reverse to cure the photocurable composition and to thereby obtain a cured product; and   separating the mold from the cured product to obtain the resist having the surface with the fine pattern.   
     
     
         12 . The method of  claim 11 , further comprising:
 disposing the photocurable composition to the surface of a substrate; and   pressing the mold while the pattern reverse of the mold is in contact with the photocurable composition;   wherein the irradiating is carried out while the photocurable composition is pressed with the mold; and   wherein during the separating at least one of the mold and the substrate and the mold, is separated from the cured product to obtain the resist having the surface with the fine pattern.   
     
     
         13 . The method of  claim 11 , further comprising:
 disposing the photocurable composition to the surface of the mold having the pattern reverse of the fine pattern; and   pressing a substrate on the photocurable composition while the photocurable composition is in contact with the pattern reverse of the mold;   wherein the irradiating is carried out while the photocurable composition is pressed with the substrate; and   wherein during the separating at least one of the mold and the substrate and the mold is separated from the cured product to obtain the resist having the surface with the fine pattern.   
     
     
         14 . The method of  claim 11 , further comprising:
 bringing a substrate and the surface of the mold having the pattern reverse of the fine pattern close together or into contact with each other so that the reverse pattern of the mold is on the substrate side; and   filling the photocurable composition between the substrate and the mold;   wherein the irradiating is carried out while the photocurable composition is between the substrate and the mold and while the substrate and the mold are close together or in contact with each other; and   wherein during the separating at least one of the mold and the substrate and the mold is separated from the cured product to obtain the resist having the surface with the fine pattern.   
     
     
         15 . The method of  claim 11 , wherein the resist having the surface with the fine pattern has a relative value dry etching resistance of at most 0.6. 
     
     
         16 . The method of  claim 11 , wherein the resist having the surface with the fine pattern has a fine pattern with at least one of a fine convex portion and a fine concave portion, and features having at least one of a height, length and width from 1 nm to 10 μm. 
     
     
         17 . The method of  claim 11 , wherein the photocurable composition contains substantially no solvent. 
     
     
         18 . The method of  claim 11 , wherein the compound (A) is an alicyclic compound having at least two rings and having two (meth)acryloyloxy groups. 
     
     
         19 . The method of  claim 11 , wherein the photocurable composition further comprises a compound (E) having two (meth)acryloyloxy groups, excluding the compounds (A) and (B), in an amount of from 5 to 30 parts by mass per 100 parts by mass of the total amount of the compound (A), the compound (B), the compound (C) and the photopolymerization initiator (D). 
     
     
         20 . The method of  claim 11 , wherein the photocurable composition further comprises a compound (F) having at least three (meth)acryloyloxy groups, excluding the compound (B), in an amount of from 5 to 90 parts by mass per 100 parts by mass of the total amount of the compound (A), the compound (B), the compound (C) and the photopolymerization initiator (D). 
     
     
         21 . The method of  claim 11 , wherein the photocurable composition further comprises a fluoropolymer (H) in an amount of from 5 to 25 parts by mass per 100 parts by mass of the total amount of the compound (A), the compound (B), the compound (C) and the photopolymerization initiator (D), and wherein the amount of the compound (B) is from 0.5 to 100 times the total mass of the fluoropolymer (H). 
     
     
         22 . The method of  claim 11 , wherein the compound (A) is at least one selected from the group consisting of 
       
         
           
           
               
               
           
         
       
     
     
         23 . The method of  claim 11 , wherein the compound (B) at least one selected from the group consisting of
   CH 2 ═CHCOOCH 2 CH 2 (CF 2 ) 6 F and
     CF 2 ═CFCF 2 C(CF 3 )(OH)CH 2 CH═CH 2 .
   
     
     
         24 . The method of  claim 11 , wherein the compound (C) is at least one selected from the group consisting of