Cooling Member for Semiconductor Light Emitting Elements

Abstract

A cooling member ( 2 ) for at least one semiconductor light emitting element ( 8 ), especially light emitting diode, having a mounting cavity ( 3 ) for accommodating at least part of control electronics ( 4 ) used for operating the at least one semiconductor light emitting element ( 8 ).

1 . A cooling member for at least one semiconductor light emitting element, especially light emitting diode, having a mounting cavity for accommodating at least part of control electronics used for operating the at least one semiconductor light emitting element. 
     
     
         2 . The cooling member as claimed in  claim 1 , wherein the control electronics is accommodated completely in the mounting cavity. 
     
     
         3 . The cooling member as claimed in  claim 1 , wherein the shape of the mounting cavity and the shape of the control electronics are adapted to each other so that there is a small distance (d) between at least one electronic component of the control electronics and a wall of the mounting cavity. 
     
     
         4 . The cooling member as claimed in  claim 3 , in which wherein at least one wall area of the wall is molded out plane-parallel to an opposing surface of the electronic component. 
     
     
         5 . The cooling member as claimed in  claim 4 , wherein at least one wall area of the wall which is molded out plane-parallel to an opposing surface of the electronic component is molded on a protrusion or recess of the mounting cavity. 
     
     
         6 . The cooling member as claimed in  claim 1 , wherein the cooling member is designed in multiple parts, with at least two parts of the cooling member each comprising a part of a wall of the mounting cavity. 
     
     
         7 . The cooling member as claimed in  claim 6 , which is designed in two parts with a mirror-symmetrical basic shape of the two parts. 
     
     
         8 . The cooling member as claimed in  claim 1 , further comprising at least one thermal interface material, TIM between at least one electronic component of the control electronics and the cooling member. 
     
     
         9 . The cooling member as claimed in  claim 8 , wherein a thermal interface material with a thermal conductivity of at least 5 W/(m·K) is inserted between at least one electronic component of the control electronics and the cooling member. 
     
     
         10 . A lamp with a cooling member as claimed in  claim 1 , with the control electronics being at least partly accommodated in the mounting cavity. 
     
     
         11 . A method for manufacturing a lamp as claimed in  claim 10 , comprising the steps of:
 at least part insertion of the control electronics into the mounting cavity;   at least part filling of the mounting cavity with at least one fluid thermal interface material; and   fixing at least one semiconductor light emitting element on the cooling member.   
     
     
         12 . The method as claimed in  claim 11 , wherein before the step of at least partly inserting the control electronics into the mounting cavity, attaching of a nonfluid thermal interface material, to at least one component of the control electronics. 
     
     
         13 . The cooling member as claimed in  claim 8 , wherein a thermally-conductive mat with a thermal conductivity of at least 5 W/(m·K) is inserted between at least one electronic component of the control electronics and the cooling member. 
     
     
         14 . The method as claimed in  claim 11 , wherein, before the step of at least partly inserting the control electronics into the mounting cavity, attaching a TIM mat to at least one component of the control electronics.