US2012178334A1PendingUtilityA1

Method of manufacturing organic el panel

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Assignee: HARA ZENICHIROPriority: Oct 5, 2009Filed: Mar 15, 2012Published: Jul 12, 2012
Est. expiryOct 5, 2029(~3.2 yrs left)· nominal 20-yr term from priority
H10W 76/60H10K 59/874H10K 71/00H10K 59/126
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Claims

Abstract

A method of manufacturing an organic EL panel includes forming a light-emitting part having at least one organic EL element on a panel substrate, forming a concave portion for housing the light-emitting part on a sealing substrate, and sealing the light-emitting part by bonding the panel substrate and the sealing substrate together through an adhesive layer. A supporting projection projecting toward the panel substrate is formed while the concave portion is being formed, and a supporting margin facing the bottom face of the supporting projection is provided where the organic EL elements are not formed within a region of the light-emitting part on the panel substrate.

Claims

exact text as granted — not AI-modified
1 - 8 . (canceled) 
     
     
         9 . A method of manufacturing an organic EL panel comprising:
 forming a light-emitting part having at least one organic EL element on a panel substrate;   forming a concave portion for housing the light-emitting part on a sealing substrate; and   sealing the light-emitting part by bonding the panel substrate and the sealing substrate together through an adhesive layer, wherein
 a supporting projection projecting toward the panel substrate is formed while the concave portion is being formed, and 
 a supporting margin facing the bottom face of the supporting projection is provided where the organic EL elements are not formed within a region of the light-emitting part on the panel substrate. 
   
     
     
         10 . The method of manufacturing an organic EL panel according to  claim 9 , wherein the forming the concave portion includes:
 a first etching process for etching the inner surface of the sealing substrate with a resist pattern formed in a forming area of the supporting projection, and   a second etching process for etching the inner surface of the sealing substrate with a resist pattern formed in an area corresponding to the bottom face of the supporting projection.

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