US2012178334A1PendingUtilityA1
Method of manufacturing organic el panel
Est. expiryOct 5, 2029(~3.2 yrs left)· nominal 20-yr term from priority
Inventors:Zenichiro HaraSatoru KiridoshiSuguru NagaeTakanori OkumuraShintaro YamasakiYuji SaitoYutaka SaitoMasashi FukuzakiMasami Kimura
H10W 76/60H10K 59/874H10K 71/00H10K 59/126
44
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Claims
Abstract
A method of manufacturing an organic EL panel includes forming a light-emitting part having at least one organic EL element on a panel substrate, forming a concave portion for housing the light-emitting part on a sealing substrate, and sealing the light-emitting part by bonding the panel substrate and the sealing substrate together through an adhesive layer. A supporting projection projecting toward the panel substrate is formed while the concave portion is being formed, and a supporting margin facing the bottom face of the supporting projection is provided where the organic EL elements are not formed within a region of the light-emitting part on the panel substrate.
Claims
exact text as granted — not AI-modified1 - 8 . (canceled)
9 . A method of manufacturing an organic EL panel comprising:
forming a light-emitting part having at least one organic EL element on a panel substrate; forming a concave portion for housing the light-emitting part on a sealing substrate; and sealing the light-emitting part by bonding the panel substrate and the sealing substrate together through an adhesive layer, wherein
a supporting projection projecting toward the panel substrate is formed while the concave portion is being formed, and
a supporting margin facing the bottom face of the supporting projection is provided where the organic EL elements are not formed within a region of the light-emitting part on the panel substrate.
10 . The method of manufacturing an organic EL panel according to claim 9 , wherein the forming the concave portion includes:
a first etching process for etching the inner surface of the sealing substrate with a resist pattern formed in a forming area of the supporting projection, and a second etching process for etching the inner surface of the sealing substrate with a resist pattern formed in an area corresponding to the bottom face of the supporting projection.Cited by (0)
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