Electronic device and fabrication method thereof

Abstract

Provided is an electronic device of high reliability having an exposed functional portion. An electronic device 10 comprises an electronic element 11 having an exposed functional portion 11 a on a first surface, a frame member 12 having a first penetration hole 12 a , and a board 13 having a second penetration hole 13 a. The frame member 12 is provided on the first surface of the electronic element 11 such that the first penetration hole 12 a faces at least a part of the functional portion 11 a . The electronic element 11 is mounted on the board 13 such that at least a part of the functional portion 11 a faces the second penetration hole 13 a. The frame member 12 does not contact with the board 13.

1 . A method for fabricating an electronic device comprising:
 making a frame member on a surface of an electronic element having an exposed functional portion on the surface such that the frame member surrounds at least a part of the functional portion; and   mounting the electronic element on a board having a penetration hole such that the penetration hole exposes the frame and the part of the functional portion.   
     
     
         2 . The method for fabricating an electronic device according to  claim 1 , wherein the electronic element is mounted on the board such that the frame member is inserted into the penetration hole in the mounting the electronic element on a board. 
     
     
         3 . The method for fabricating an electronic device according to  claim 1 , wherein the making a frame member comprises:
 forming a precursor film for a frame member on the electronic element; and   processing the precursor film for a frame member such that at least a part of the functional portion is exposed.   
     
     
         4 . The method for fabricating an electronic device according to  claim 1 , wherein mounting the electronic element on a board further comprises:
 attaching the electronic element and the board via an electronic conductive member formed on the surface of the electronic element; and   providing an underfill resin around the electronic conductive member and between the electronic element and the board,   wherein the underfill resin is blocked from reaching to the electronic element by the frame member.   
     
     
         5 . The method for fabricating an electronic device according to  claim 4 , wherein mounting the electronic element on a board further comprises:
 sandwiching the electronic element and the board between a first sealing die and a second sealing die after the providing an underfill resin; and   providing a sealing resin in a apace formed by the electronic element, the board and one of the first sealing die and the second sealing die such that the sealing resin is blocked from reaching to the electronic element by the frame member.   
     
     
         6 . The method for fabricating an electronic device according to  claim 5 , wherein a gap is formed between an outer surface of the frame member and an internal surface of the penetration hole of the board. 
     
     
         7 . The method for fabricating an electronic device according to  claim 5 , wherein a buffer sheet is provided between the electronic element and one of the first sealing die and the second sealing die. 
     
     
         8 . The method for fabricating an electronic device according to  claim 1 , wherein mounting the electronic element on a board further comprises:
 attaching the electronic element and the board via an electronic conductive member formed on the surface of the electronic element;   sandwiching the electronic element and the board between a first sealing die and a second sealing die after the providing an underfill resin; and   providing a sealing resin in a space formed by the electronic element, the board and one of the first sealing die and the second sealing die such that the sealing resin is blocked from reaching to the electronic element by the frame member.   
     
     
         9 . The method for fabricating an electronic device according to  claim 8 , wherein the sealing resin is formed between an outer surface of the frame member and an internal surface of the penetration hole of the board. 
     
     
         10 . The method for fabricating an electronic device according to  claim 1 , wherein the frame member has a height of 0.03 mm or more. 
     
     
         11 . The method for fabricating an electronic device according to  claim 1 , wherein the frame member is made of resin.