Robotic placement machine for optical bonding, system and method of use thereof

Abstract

A robotic placement machine including a base operably connected to the Y axis actuator and the X axis actuator, a first Z axis actuator coupled to the first end of the base, the first Z axis actuator capable of moving up and down a first Z axis, a second Z axis actuator coupled to the second end of the base, the second Z axis actuator capable of moving up and down a second Z axis, and a pick and place plate operably connected to the first Z axis actuator and the second Z axis actuator, wherein the first Z axis actuator and the second Z axis actuator are each capable of moving independently of each other to tilt the pick and place plate is provided. Furthermore, a system comprising a first machine, second machine, and third machine to eliminate air bubbles when bonding two substrates is also provided. A method of optical bonding is further provided.

1 . A robotic placement machine configured to attach to a Y axis actuator for moving along a Y axis and a X axis actuator for moving along an X axis, the robotic placement machine comprising:
 a base operably connectable to at least one of the Y-axis actuator and the X-axis actuator, the base having a first end and a second end;   a first Z-axis actuator coupled to the first end of the base, the first Z-axis actuator capable of moving up and down a first Z-axis;   a second Z axis actuator coupled to the second end of the base, the second Z axis actuator capable of moving up and down a second Z axis; and   a pick and place plate operably connected to the first Z axis actuator and the second Z axis actuator;   wherein the first Z-axis actuator and the second Z-axis actuator are each capable of moving independently of each other to tilt the pick and place plate.   
     
     
         2 . The robotic placement machine of  claim 1 , further comprising:
 a first mounting plate having a first surface and a second surface, wherein the first Z-axis actuator is coupled to the first mounting plate;   a second mounting plate having a first surface and a second surface, wherein the second Z-axis actuator is coupled to the second mounting plate;   a first bearing system coupled to the first surface of the first mounting plate; and   a second bearing system coupled to the first surface of the second mounting plate;   wherein the first bearing system and the second bearing system mechanically allow tilting of the pick and place plate.   
     
     
         3 . The robotic placement machine of  claim 2 , wherein the first and second bearing systems each include a bearing fitted within a housing fastened to an underside, capable of supporting a shaft to facilitate the tilt of the pick and place plate. 
     
     
         4 . The robotic placement machine of  claim 1 , wherein the pick and place plate is coupled to the underside, the underside coupled to the first bearing system and the second bearing system. 
     
     
         5 . The robotic placement machine of  claim 1 , further comprising:
 a height sensor coupled to the base to detect a surface height of a substrate;   a plurality of UV light wands coupled to the underside; and   a vision system coupled to the base to detect an orientation of components associated with the robotic placement machine.   
     
     
         6 . The robotic placement machine of  claim 1 , wherein the pick and place plate is a vacuum plate for picking and placing the substrate. 
     
     
         7 . The robotic placement machine of  claim 1 , wherein movement of the robotic placement machine is computer programmable. 
     
     
         8 . A system comprising:
 a first machine, wherein the first machine includes a valve coupled to a first end effector, the valve applying a material around a perimeter of a first substrate to form a dam;   a second machine, wherein the second machine includes a custom head coupled to a second end effector, the custom head dispensing a fill material across a surface of the first substrate, wherein the dispensed fill material has a variable fill height; and   a third machine, wherein the third machine includes a third end effector, the third end effector configured to pick a second substrate and controllably lower the second substrate onto the first substrate;   wherein each of the first machine, second machine, and third machine are operably connected.   
     
     
         9 . The system of  claim 8 , wherein the first machine, the second machine, and the third machine are each a Gantry robot. 
     
     
         10 . The system of  claim 8 , wherein the fill height has a largest fill height proximate a rear edge of the first substrate and a lowest fill height proximate a front edge of the first substrate. 
     
     
         11 . The system of  claim 8 , wherein the fill height has a largest fill height at a middle portion of the first substrate. 
     
     
         12 . The system of  claim 8 , wherein the third end effector is configured to place the second substrate onto the first substrate at a placement angle establishing an initial contact between the first and second substrate proximate the rear edge of the first substrate. 
     
     
         13 . The system of  claim 8 , wherein the third end effector is configured to controllably lower the second substrate onto the first substrate, wherein the second substrate is parallel to the first substrate. 
     
     
         14 . The system of  claim 8 , wherein the first machine, the second machine, and the third machine are operably connected by a conveyor system, wherein the conveyor system moves the first substrate through the system. 
     
     
         15 . The system of  claim 8 , wherein the valve is a dispensing valve to dispense a dam material, wherein the dam material is a UV material. 
     
     
         16 . The system of  claim 8 , wherein the first machine also includes:
 at least one vacuum plate coupled to an underside, the at least one vacuum plate configured to temporarily prevent movement of the first substrate;   a UV wand coupled to the first end effector to stabilize the dam after application, wherein a light source is connected to the UV wand;   a first height sensor coupled to the first end effector to detect a surface height of the first substrate; and   a first vision system coupled to the first end effector to detect an orientation of the first and second substrates associated with the first machine.   
     
     
         17 . The system of  claim 8 , wherein the dam may have one or more vents to allow air to escape as the second substrate is controllably lowered onto the first substrate. 
     
     
         18 . The system of  claim 8 , wherein the second machine also includes:
 a treatment head coupled to the second end effector to treat the surface of the first substrate; and   a second vision system coupled to the second end effector to detect an orientation of components associated with the second machine.   
     
     
         19 . The system of  claim 8 , wherein the custom head is one or more dispensing valves for dispensing fill material, wherein the fill material is an optically clear adhesive. 
     
     
         20 . The system of  claim 8 , wherein the fill material being dispensed covers 80%-95% of the surface of the first substrate. 
     
     
         21 . The system of  claim 8 , wherein the third end effector includes a second height sensor configured to locate and align the first substrate. 
     
     
         22 . The system of  claim 8 , wherein controllably lowering the second substrate onto the first substrate forces the fill material to create a capillary effect as it flows across the surface thereby preventing and eliminating air bubbles between the first and second substrate. 
     
     
         23 . The system of  claim 8 , further including a UV cure oven operably connected to the third machine, the UV cure oven configured to accept the bonded substrates. 
     
     
         24 . The system of  claim 8 , wherein the first substrate and the second substrates are transparent substrates. 
     
     
         25 . The system of  claim 12 , wherein the angle of placement is between 0° and 20°. 
     
     
         26 . A method of optical bonding comprising:
 dispensing a fill material across a surface of the first substrate to achieve a largest fill height proximate a rear edge of the first substrate and a lowest fill height proximate a front edge of the first substrate;   placing a second substrate into contact with the fill material proximate the rear edge of the first substrate at an angle relative to the first substrate; and   controllably lowering the second substrate onto the first substrate until the second substrate is bonded to the first substrate to prevent and eliminate air bubbles between the first and second substrates.   
     
     
         27 . The method of  claim 26 , wherein the first substrate and the second substrate are transparent substrates. 
     
     
         28 . The method of  claim 26 , wherein the fill material is an optically clear adhesive. 
     
     
         29 . The method of  claim 26 , further including:
 dispensing dam material around a perimeter of the first substrate to form a dam;   tracing the dam material with a UV wand to stabilize the dam material;   treating the surface of the first substrate with a treatment head prior to dispensing fill material onto the surface of the first substrate;   locating and aligning the second substrate for placement onto the first substrate;   locating the rear edge of the first substrate with a height sensor; and   placing the bonded substrates into a cure oven.   
     
     
         30 . The method of  claim 26 , wherein the dam may have one or more vents to allow air to escape as the second substrate is controllably lowered onto the first substrate 
     
     
         31 . The method of  claim 26 , wherein controllably lowering the second substrate onto the first substrate forces the fill material to create a capillary effect as it flows across the surface of the first substrate. 
     
     
         32 . The method of  claim 28 , wherein the angle of placement is between 0° and 20°. 
     
     
         33 . The method of  claim 28 , wherein the fill material is dispensed across the surface of the first substrate to cover 80%-95% of the surface of the first substrate. 
     
     
         34 . A method of optical bonding comprising:
 dispensing a fill material across a surface of the first substrate to achieve a largest fill height proximate a middle portion of the first substrate;   placing a second substrate into contact with the fill material proximate the middle portion of the first substrate substantially parallel to the first substrate; and   controllably lowering the second substrate onto the first substrate until the second substrate is bonded to the first substrate to prevent and eliminate air bubbles between the first and second substrates.   
     
     
         35 . The method of  claim 34 , wherein the first substrate and the second substrate are transparent substrates. 
     
     
         36 . The method of  claim 34 , wherein the fill material is an optically clear adhesive. 
     
     
         37 . The method of  claim 34 , further including:
 dispensing dam material around a perimeter of the first substrate to form a dam;   tracing the dam material with a UV wand to stabilize the dam material;   treating the surface of the first substrate with a treatment head prior to dispensing fill material onto the surface of the first substrate;   locating and aligning the second substrate for placement onto the first substrate;   locating that least one of a rear edge, front edge, and the middle portion of the first substrate with a height sensor; and   placing the bonded substrates into a cure oven.   
     
     
         38 . The method of  claim 34 , wherein the dam may have one or more vents to allow air to escape as the second substrate is controllably lowered onto the first substrate 
     
     
         39 . The method of claim  47 , wherein controllably lowering the second substrate onto the first substrate forces the fill material to create a capillary effect as it flows across the surface of the first substrate. 
     
     
         40 . The method of  claim 34 , wherein the fill material is dispensed across the surface of the first substrate to cover 80%-95% of the surface of the first substrate.