US2012181603A1PendingUtilityA1
Vertical channel type non-volatile memory device and method for fabricating the same
Est. expiryAug 3, 2029(~3.1 yrs left)· nominal 20-yr term from priority
Inventors:Jung Ryul Ahn
H10D 30/69H10D 30/681H10D 30/6728H10D 30/0411H10D 30/0413H10D 64/037H10D 64/035H10D 30/693H10B 43/20H10B 41/27H10B 41/20H10W 10/0121
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Claims
Abstract
A method for fabricating a vertical channel type non-volatile memory device including forming a source region, alternately forming a plurality of interlayer dielectric layers and a plurality of conductive layers for a gate electrode over a substrate with the source region formed therein, forming a trench exposing the source region by etching the plurality of interlayer dielectric layers and the plurality of conductive layers for a gate electrode, and siliciding the conductive layers for a gate electrode and the source region that are exposed through the trench.
Claims
exact text as granted — not AI-modified1 - 8 . (canceled)
9 . A vertical channel type non-volatile memory device, comprising:
a source region; a channel configured to be coupled with the source region and protruding from a substrate; and a plurality of memory cells stacked along the channel, wherein the source region and a gate electrode of each memory cell include a silicided portion.
10 . The vertical channel type non-volatile memory device of claim 9 , further comprising:
a lower selection transistor and an upper selection transistor each including a gate electrode having a silicided portion.
11 . The vertical channel type non-volatile memory device of claim 9 , further comprising:
a contact plug coupled with the source region.Cited by (0)
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