US2012183300A1PendingUtilityA1

Optical network unit transceiver module having direct connect rf pin configuration

Assignee: LIU JINXIANGPriority: Aug 13, 2007Filed: Mar 26, 2012Published: Jul 19, 2012
Est. expiryAug 13, 2027(~1.1 yrs left)· nominal 20-yr term from priority
H05K 1/141H05K 1/0219H05K 1/0237H05K 2201/042H05K 2201/10318
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Claims

Abstract

Methods for providing a direct connect RF pin configuration for an ONU transceiver module to connect directly to an external component. The ONU module communicates with an optical network. The ONU module further includes an RF interface and a direct connect RF pin configuration to communicate using RF signals. In one embodiment, the direct connect RF pin configuration includes two ground pins and a data pin which are spaced apart and directly connected to a PCB of the ONU. The opposing ends of the pins are directly connected to a PCB of an external component, such as an ONU host box. The pins are thus spaced apart such that they do not impede each others' function and available for direct connection to the external component.

Claims

exact text as granted — not AI-modified
1 . A method for constructing a direct connection between an optical network unit module and an external component, the method comprising:
 tuning one or more characteristics of at least one ground pin and at least one data pin to achieve a desired impedance;   securing a first end of the at least one ground pin and the at least one data pin to an RF interface of an optical network unit such that the at least one ground pin is spaced apart from the at least one data pin;   disposing a second end of the at least one ground pin and the at least one data pin through a housing of the optical network unit wherein the second end of the at least one ground pin and the at least one data pin extends outwardly and is available to be directly connected to an external component; and   securing the second end of the at least one ground pin and the at least one data pin to a printed circuit board (PCB) of the external component.   
     
     
         2 . The method of  claim 1 , wherein the one or more characteristics of the at least one ground pin and the at least one data pin includes size, shape, composition and attachment method. 
     
     
         3 . The method of  claim 1 , wherein tuning one or more characteristics of the at least one ground pin and the at least one data pin includes utilizing optimization software. 
     
     
         4 . The method of  claim 1 , wherein tuning one or more characteristics of the at least one ground pin and the at least one data pin includes iteratively changing characteristics to achieve a desired impedance. 
     
     
         5 . The method of  claim 1 , wherein tuning one or more characteristics of the at least one ground pin and the at least one data pin includes tuning using simulation software. 
     
     
         6 . The method of  claim 1 , further comprising:
 determining a desired limit to back reflection at the RF interface; and   tuning one or more characteristics of the at least one ground pin and the at least one data pin to achieve the desired limit to back reflection.   
     
     
         7 . The method of  claim 1 , wherein securing a first end of the at least one ground pin and the at least one data pin to an RF interface of an optical network unit and securing the second end of the at least one ground pin and the at least one data pin to a PCB of the external component comprises using at least one of soldering, welding, applying conductive epoxy, applying conductive adhesive, or using a slip fit connection.

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