Stencil with pattern and method for forming pattern on workpiece

Abstract

A stencil with pattern includes a porous material and a masking pattern layer disposed on the porous material. The masking pattern layer includes a patterned mask area covering a portion of the porous material. When electroplating or etching is performed, the stencil with pattern is laminated with a workpiece so that the patterned mask area covers a portion of a working surface of the workpiece, and is placed into an electroplating tank or etch tank. The portion of the working surface not covered by the patterned mask area undergoes electroplating or etching reaction, resulting in electroplated or etched pattern on the workpiece. There may also be a screen structure interposed between the porous material and the masking pattern layer. The method of forming a pattern on a workpiece using the stencil with pattern has advantages of simplified process, significant time-to-product reduction, and product yield enhancement.

1 . A stencil with pattern comprising:
 a screen structure comprising at least a layer of reticular structure and a frame structure disposed on a periphery of the reticular structure, the reticular structure comprising a first surface and an opposite second surface;   a masking pattern layer connected to the first surface of the reticular structure, the masking pattern layer comprising a patterned mask area covering a portion of the reticular structure; and   a porous material disposed on the second surface of the reticular structure, the porous material having pores allowing a reaction liquid to flow therethrough and to the area not covered by the patterned mask area.   
     
     
         2 . The stencil with pattern according to  claim 1 , wherein the masking pattern layer is connected to the first surface and extends to the second surface of the reticular structure. 
     
     
         3 . The stencil with pattern according to  claim 1 , wherein the frame structure provides a tension to the reticular structure so as to keep the masking pattern layer even. 
     
     
         4 . The stencil with pattern according to  claim 1 , wherein the reaction liquid is an electroplating liquid or an etching liquid. 
     
     
         5 . The stencil with pattern according to  claim 4 , wherein the masking pattern layer comprises plating-resistant or etch-resistant material. 
     
     
         6 . The stencil with pattern according to  claim 1 , wherein the patterned mask area is formed by utilizing a machining, laser processing or chemical processing technique. 
     
     
         7 . A stencil with pattern comprising:
 a porous material having pores allowing a reaction liquid to flow therethrough; and   a masking pattern layer connected to one side of the porous material and extending to the porous material, the masking pattern layer comprising a patterned mask area covering a portion of the porous material.   
     
     
         8 . The stencil with pattern according to  claim 7 , wherein the reaction liquid is an electroplating liquid or an etching liquid. 
     
     
         9 . The stencil with pattern according to  claim 8 , wherein the masking pattern layer comprises plating-resistant or etch-resistant material. 
     
     
         10 . The stencil with pattern according to  claim 7 , wherein the patterned mask area is formed by utilizing a machining, laser processing or chemical processing technique. 
     
     
         11 . A method for forming a pattern on a workpiece comprising:
 providing a workpiece having a working surface;   providing a stencil with pattern, the stencil with pattern comprising a porous material and a masking pattern layer disposed on the porous material, the masking pattern layer comprising a patterned mask area;   disposing the stencil with pattern on the workpiece such that the patterned mask area covers a portion of the working surface;   placing the workpiece and the stencil with pattern into a reaction tank, whereby a reaction liquid flows through the porous material and to the portion of the working surface not covered by the patterned mask area to undergo a chemical reaction; and   removing the stencil with pattern.   
     
     
         12 . The method for forming a pattern on a workpiece according to  claim 11 , wherein the reaction tank is an electroplating tank, the reaction liquid is an electroplating liquid, and the chemical reaction involves forming an electroplated pattern on the portion of the workpiece not covered by the patterned mask area. 
     
     
         13 . The method for forming a pattern on a workpiece according to  claim 11 , wherein the reaction tank is an etch tank, the reaction liquid is an etch liquid, and the chemical reaction involves creating an etched pattern on the portion of the working surface not covered by the patterned mask area. 
     
     
         14 . The method for forming a pattern on a workpiece according to  claim 11 , wherein the stencil with pattern further comprising a screen structure disposed between the porous material and the masking pattern layer. 
     
     
         15 . The method for forming a pattern on a workpiece according to  claim 14 , wherein the screen structure comprises at least a reticular structure and a frame structure disposed on a periphery of the reticular structure, the reticular structure is bound with the masking pattern layer, and the frame structure provides a tension to the reticular structure so as to keep the masking pattern layer even. 
     
     
         16 . The method for forming a pattern on a workpiece according to  claim 11 , wherein the masking pattern layer comprises plating-resistant or etch-resistant material.