Cermet-containing bushing for an implantable medical device having a connecting layer

Abstract

One aspect relates to an electrical bushing for use in a housing of an implantable medical device. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body. The at least one conducting element includes at least one cermet. The at least one conducting element includes at least one electrically conductive connecting layer.

1 . An electrical bushing for use in a housing of an implantable medical device;
 whereby the electrical bushing comprises at least one electrically insulating base body and at least one electrical conducting element;   whereby the conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space;   whereby the conducting element is hermetically sealed with respect to the base body;   whereby the at least one conducting element comprises at least one cermet;   whereby the at least one conducting element comprises at least one electrically conductive connecting layer.   
     
     
         2 . The electrical bushing according to  claim 1 , whereby the base body and the at least one conducting element are connected in a firmly bonded manner through a firmly bonded sintered connection. 
     
     
         3 . The electrical bushing according to  claim 1 , whereby the connecting layer includes a metal. 
     
     
         4 . The electrical bushing according to  claim 2 , whereby the metal is selected from the group consisting of gold, silver, and platinum, as well as at least two thereof. 
     
     
         5 . The electrical bushing according to  claim 2 , whereby a wire-like structure is adjacent to the at least one connecting layer. 
     
     
         6 . The electrical bushing according to  claim 1 , whereby at least one conducting element comprises at least two connecting layers. 
     
     
         7 . The electrical bushing according to  claim 1 , whereby the cermet comprises a ceramic component selected from the group consisting of: aluminum oxide, zirconium oxide, zirconium-modified aluminum, aluminum-modified zirconium, Yttrium-toughened zirconium oxide, aluminum nitrite, magnesium oxide, and piezoceramic materials, as well as at least two thereof. 
     
     
         8 . The electrical bushing according to  claim 1 , whereby the cermet comprises a metal component selected from the group consisting of: platinum, iridium, niobium, molybdenum, tantalum, and tungsten, as well as at least two thereof. 
     
     
         9 . The electrical bushing according to  claim 1 , whereby the base body is selected from the group consisting of: aluminum oxide, zirconium oxide, zirconium-modified aluminum, aluminum-modified zirconium, Yttrium-toughened zirconium oxide, aluminum nitrite, magnesium oxide, and piezoceramic materials, as well as at least two thereof. 
     
     
         10 . The electrical bushing according to  claim 1 , whereby the wire-like structure includes a metal component that is selected from the group consisting of: platinum, iridium, niobium, molybdenum, tantalum, titanium, tungsten, iron, cobalt, and chromium, as well as at least two thereof. 
     
     
         11 . The electrical bushing according to  claim 1 , whereby the base body is made, at least in part, from an insulating composition of materials. 
     
     
         12 . The electrical bushing according to  claim 1 , whereby the insulating composition of materials is selected from the group consisting of: aluminum oxide, magnesium oxide, zirconium oxide, aluminum titanate, and piezoceramic materials, as well as at least two thereof. 
     
     
         13 . An implantable medical device comprising:
 a housing; and   an electrical bushing used in the housing and comprises at least one electrically insulating base body and at least one electrical conducting element;   whereby the conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space;   whereby the conducting element is hermetically sealed with respect to the base body;   whereby the at least one conducting element comprises at least one cermet;   whereby the at least one conducting element comprises at least one electrically conductive connecting layer.   
     
     
         14 . A method for the manufacture of an electrical bushing for an implantable medical device, whereby the method comprises the following steps:
 a. generating at least one base body green compact for at least one base body from an insulating composition of materials;   b. forming at least one cermet-containing conducting element green compact for at least one conducting element;   c. introducing the at least one conducting element green compact into the base body green compact;   d. connecting the insulation element green compact to the at least one base body green compact in order to obtain at least one base body having at least one conducting element;   e. applying a connecting layer onto the at least one conducting element.   
     
     
         15 . The method according to  claim 14 , whereby the connecting layer is made from a metal. 
     
     
         16 . The method according to  claim 15 , whereby the metal is selected from the group consisting of gold, silver, and platinum, as well as at least two thereof. 
     
     
         17 . The method according to  claim 14 , whereby step a) comprises a partial sintering of the base body green compact. 
     
     
         18 . The method according to  claim 14 , whereby step b) comprises a partial sintering of the conducting element green compact. 
     
     
         19 . The method according to  claim 14 , whereby the connecting layer is applied by printing, electroplating, micro-dosing or through a vaporization process or a combination thereof. 
     
     
         20 . The method according to  claim 14  further comprising forming an electrical bushing from the at least one electrically insulating base body and the at least one electrical conducting element.