Electrolytic copper plating solution composition

Abstract

Disclosed is an electrolytic copper plating solution composition, which includes a copper salt, an acidic solution, and a PEG-PPG-PEG copolymer, and in which the PEG-PPG-PEG copolymer which is a non-ionic surfactant is added, thus decreasing the surface tension of the electrolytic copper plating solution, thereby enhancing plating wettability.

1 . An electrolytic copper plating solution composition, comprising a copper salt, an acidic solution, and a PEG (polyethylene glycol)-PPG (polypropylene glycol)-PEG copolymer. 
     
     
         2 . The composition of  claim 1 , wherein the PEG-PPG-PEG copolymer has an average molecular weight ranging from 1000 Da to 3000 Da. 
     
     
         3 . The composition of  claim 1 , wherein the PEG-PPG-PEG copolymer has a weight ratio of PEG:PPG ranging from 1:1 to 1:9. 
     
     
         4 . The composition of  claim 1 , comprising 5˜30 wt % of the copper salt, 65˜90 wt % of the acidic solution, and 0.1˜10 wt % of the PEG-PPG-PEG copolymer. 
     
     
         5 . The composition of  claim 1 , wherein the copper salt is copper sulfate, copper nitrate, cupric chloride, copper formate, or a mixture thereof. 
     
     
         6 . The composition of  claim 1 , wherein the acidic solution is a sulfuric acid solution, a hydrochloric acid solution, an acetic acid solution or a fluoroboric acid solution. 
     
     
         7 . The composition of  claim 1 , further comprising one or more additives selected from the group consisting of a brightener, a leveler and a carrier.