Method for manufacturing wiring board

Abstract

A method for manufacturing a wiring board including forming an insulative resin layer, forming a power-supply layer on the insulative resin layer, forming a conductive layer made of electrolytic plating and having a conductive pattern on the power-supply layer such that the power-supply layer has an exposed portion not covered by a conductive portion of the conductive pattern, and irradiating the exposed portion of the power-supply layer with laser having a wavelength in a range of approximately 350 nm to approximately 600 nm at a pulse width in a range of approximately 0.1 picosecond to approximately 1,000 picoseconds such that the exposed portion of the power-supply layer is removed from the insulative resin layer.

1 . A method for manufacturing a wiring board, comprising:
 forming an insulative resin layer;   forming a power-supply layer on the insulative resin layer;   forming a conductive layer comprising electrolytic plating and having a conductive pattern on the power-supply layer such that the power-supply layer has an exposed portion not covered by a conductive portion of the conductive pattern; and   irradiating the exposed portion of the power-supply layer with laser having a wavelength in a range of approximately 350 nm to approximately 600 nm at a pulse width in a range of approximately 0.1 picosecond to approximately 1,000 picoseconds such that the exposed portion of the power-supply layer is removed from the insulative resin layer.   
     
     
         2 . The method for manufacturing a wiring board according to  claim 1 , wherein the pulse width of the laser is in a range of approximately 0.1 picosecond to approximately 100 picoseconds. 
     
     
         3 . The method for manufacturing a wiring board according to  claim 1 , wherein the irradiating of laser comprises irradiating the conductive layer and the exposed portion of the power-supply layer without a mask. 
     
     
         4 . The method for manufacturing a wiring board according to  claim 3 , wherein the irradiating of laser comprises irradiating the conductive layer and the exposed portion of the power-supply layer by spot-irradiation. 
     
     
         5 . The method for manufacturing a wiring board according to  claim 3 , further comprising forming an insulation layer on the conductive layer without a roughening treatment of the conductive layer after the irradiating of laser. 
     
     
         6 . The method for manufacturing a wiring board according to  claim 1 , wherein the irradiating of laser comprises irradiating the conductive layer and the exposed portion of the power-supply layer such that the exposed portion of the power-supply layer is removed and the conductive layer is roughened simultaneously. 
     
     
         7 . The method for manufacturing a wiring board according to  claim 1 , wherein the irradiating of laser comprises subliming the exposed portion of the power-supply layer. 
     
     
         8 . The method for manufacturing a wiring board according to  claim 1 , wherein the forming of the insulative resin layer comprises forming the insulative resin layer comprising an inorganic filler in an amount of approximately 30 wt. % or greater. 
     
     
         9 . The method for manufacturing a wiring board according to  claim 8 , wherein the forming of the power-supply layer comprises forming the power-supply layer made of copper, and the forming of the insulative resin layer comprises forming the insulative resin layer comprising one of a silica filler and a white filler as the inorganic filler. 
     
     
         10 . The method for manufacturing a wiring board according to  claim 8 , wherein the inorganic filler is a spherical filler. 
     
     
         11 . The method for manufacturing a wiring board according to  claim 1 , wherein the irradiating of laser comprises irradiating the exposed portion of the power-supply layer with one of YAG laser, YVO 4  laser, argon ion laser, semiconductor laser, fiber laser, disc laser and copper vapor laser. 
     
     
         12 . The method for manufacturing a wiring board according to  claim 1 , wherein the forming of the conductive layer comprises forming a plating resist layer having a pattern on the power-supply layer and applying electrolytic plating on the power-supply layer through the plating resist layer, and the irradiating of laser comprises removing the plating resist layer from the power-supply layer. 
     
     
         13 . A method for manufacturing a wiring board, comprising:
 forming an insulative resin layer;   forming a power-supply layer on the insulative resin layer;   forming a conductive layer comprising electrolytic plating and having a conductive pattern on the power-supply layer such that the power-supply layer has an exposed portion not covered by a conductive portion of the conductive pattern;   forming a flow of one of a liquid and an inert gas over the exposed portion of the power-supply layer such that one of the liquid and the inert gas is in contact with the exposed portion of the power-supply layer; and   irradiating the exposed portion of the power-supply layer with laser having a wavelength in a range of approximately 350 nm to approximately 600 nm such that the exposed portion of the power-supply layer is removed from the insulative resin layer.   
     
     
         14 . The method for manufacturing a wiring board according to  claim 13 , wherein the irradiating of laser comprises irradiating the exposed portion of the power-supply layer while the flow of one of the liquid and the inert gas is formed over the exposed portion of the power-supply layer such that one of the liquid and the inert gas is in contact with the exposed portion of the power-supply layer. 
     
     
         15 . The method for manufacturing a wiring board according to  claim 13 , wherein the irradiating of laser comprises irradiating laser a plurality of times by changing irradiation spots, and the forming of the flow comprises forming the flow of one of the liquid and the inert gas such that one of the liquid and the inert gas is set in contact with the exposed portion of the power-supply layer after each irradiation of laser and prior to a following irradiation of laser. 
     
     
         16 . The method for manufacturing a wiring board according to  claim 13 , wherein the forming of the flow comprises placing the power-supply layer into the flow of the liquid, and the irradiating of laser comprises irradiating the exposed portion of the power-supply layer in the liquid. 
     
     
         17 . The method for manufacturing a wiring board according to  claim 13 , wherein the forming of the insulative resin layer comprises forming the insulative resin layer comprising an inorganic filler in an amount of approximately 30 wt. % or greater. 
     
     
         18 . The method for manufacturing a wiring board according to  claim 17 , wherein the forming of the power-supply layer comprises forming the power-supply layer made of copper, and the forming of the insulative resin layer comprises forming the insulative resin layer comprising a silica filler as the inorganic filler. 
     
     
         19 . The method for manufacturing a wiring board according to  claim 17 , wherein the forming of the insulative resin layer comprises forming the insulative resin layer comprising a spherical filler as the inorganic filler. 
     
     
         20 . The method for manufacturing a wiring board according to  claim 13 , wherein the irradiating of laser comprises irradiating the exposed portion of the power-supply layer with one of YAG laser, YVO 4  laser, argon ion laser, semiconductor laser, fiber laser, disc laser and copper vapor laser. 
     
     
         21 . The method for manufacturing a wiring board according to  claim 13 , the forming of the conductive layer comprises forming a plating resist layer having a pattern on the power-supply layer and applying electrolytic plating on the power-supply layer through the plating resist layer, and the irradiating of laser comprises removing the plating resist layer from the power-supply layer.