Mounting device

Abstract

A mounting device includes a mounting body for mounting thereon a target object to be subjected to a predetermined process; and a cooling mechanism for cooling the target object via the mounting table. The cooling mechanism includes a heat exchanger provided at a bottom surface of the mounting table, and a cooling unit having a heat absorbing unit for absorbing heat from a heat transfer medium of the heat exchanger. Further, the cooling unit is fixed to the heat exchanger through the heat absorbing unit.

1 . A mounting device comprising:
 a mounting body for mounting thereon a target object to be subjected to a predetermined process; and   a cooling mechanism for cooling the target object via the mounting table,   wherein the cooling mechanism includes a heat exchanger provided at a bottom surface of the mounting table, and a cooling unit having a heat absorbing unit for absorbing heat from a heat transfer medium of the heat exchanger, and   wherein the cooling unit is fixed to the heat exchanger through the heat absorbing unit.   
     
     
         2 . The mounting device of  claim 1 , wherein the cooing unit is configured as a Stirling cooler. 
     
     
         3 . The mounting device of  claim 1 , wherein the heat transfer medium is made of metal. 
     
     
         4 . The mounting device of  claim 1 , further comprising a support body for supporting the mounting body at an outer periphery thereof and an elevation mechanism for vertically moving the support body. 
     
     
         5 . The mounting device of  claim 4 , wherein the elevation mechanism is configured as a cylinder mechanism. 
     
     
         6 . The mounting device of  claim 1 , wherein the substrate to be processed is subjected to an electrical characteristic inspection.