US2012217043A1PendingUtilityA1
Method of manufacturing a printed circuit board
Est. expiryNov 26, 2028(~2.4 yrs left)· nominal 20-yr term from priority
Inventors:Se Won Park
Y10T29/49126H05K 3/184H05K 3/06H05K 3/12Y10T29/49165H05K 3/107H05K 3/465H05K 2203/095H05K 2203/0582Y10T29/49144H05K 2203/025Y10T29/4913
40
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Claims
Abstract
Disclosed herein is a method of manufacturing a printed circuit board having a buried pattern, including: forming a second insulation layer on a first insulation layer, the second insulation layer having openings for forming a circuit layer; and filling the openings with a conductive metal to form a circuit layer.
Claims
exact text as granted — not AI-modified1 . A printed circuit board having a buried pattern, comprising:
a first insulation layer; a second insulation layer which is formed on the first insulation layer and has openings for forming a circuit layer; and a circuit layer charged in the openings and made of a conductive metal, wherein an interface is formed between the first insulation layer and the second insulation layer.
2 . The printed circuit board according to claim 1 , wherein the first insulation layer has higher filler content than the second insulation layer.
3 . The printed circuit board according to claim 1 , further comprising:
a via made of a conductive metal passing through the first insulation layer and the second insulation layer.Cited by (0)
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