Medical Electrical Lead

Abstract

An improved medical electrical lead is disclosed herein. The lead may include a longitudinally extending body having a distal end, a proximal end, a conductive element extending between the distal and proximal ends, and an electrode coupled to the conductive element utilizing a reflow process. The conductive element and electrode may comprise materials that are incompatible.

1 . An implantable medical electrical lead device, comprising:
 a lead body having a length between a proximal end and a distal end, wherein the lead body defines a longitudinal axis extending between the proximal end and the distal end;   a conductive element located within an interior of the lead body and extending along the longitudinal axis for at least a portion of the length of the lead body;   an electrode positioned over the exterior surface of the lead body and bonded to the conductive element at a coupling joint, wherein the coupling joint is formed by reflowing the conductive element onto the electrode.   
     
     
         2 . The implantable medical device lead of  claim 1 , wherein the conductive element is constructed of a first material and the electrode is constructed of a second material. 
     
     
         3 . The implantable medical device lead of  claim 1 , wherein the first material consists essentially of at least one of the following: tantalum, platinum, gold, iridium, rhenium, tungsten, ruthenium, depleted uranium, cobalt, chromium, titanium, aluminum, vanadium, chromium, nickel, molybdenum, iron, copper, silver, gold, stainless steel, magnesium-nickel, palladium and alloys thereof. 
     
     
         4 . The implantable medical device lead of  claim 3 , wherein the first material consists essentially of a cobalt-based alloy. 
     
     
         5 . The implantable medical device lead of  claim 1 , wherein the second material consists essentially of at least one of the following: tantalum, platinum, gold, iridium, rhenium, tungsten, ruthenium, depleted uranium, cobalt, chromium, titanium, aluminum, vanadium, chromium, nickel, molybdenum, iron, copper, silver, gold, stainless steel, magnesium-nickel, palladium and alloys thereof. 
     
     
         6 . The implantable medical device lead of  claim 5 , wherein the second material consists essentially of a tantalum alloy. 
     
     
         7 . The implantable medical device lead of  claim 1 , wherein the reflow of the conductive element onto the electrode is formed by welding. 
     
     
         8 . The implantable medical device lead of  claim 7 , wherein the welding process includes application of a laser beam having a frequency in the range of about 5-15 Hz, with an energy level between 0.5-3 J and is applied for a duration in the range of 0.5-3.0 ms 
     
     
         9 . A method for manufacturing an implantable medical electrical lead device, comprising:
 providing a lead sub-assembly comprising an elongate conductor, an electrode and a first insulative layer;   covering at least a portion of the elongate conductor with the first insulative layer to form an elongate device body;   positioning the electrode at a predetermined location on the elongate conductor; and   coupling the electrode to the elongate conductor, wherein the coupling includes reflowing the material of the elongate conductor onto the electrode.   
     
     
         10 . The method of  claim 9 , further comprising:
 providing a conductive fitting; and   coupling the conductive fitting to the elongate conductor at the predetermined location prior to positioning the electrode at the predetermined location, wherein the electrode is directly coupled to the conductive fitting.   
     
     
         11 . The method of  claim 9 , further comprising:
 providing a second insulative layer; and   covering the elongate device body with the second insulative body.   
     
     
         12 . The method of  claim 9 , wherein the elongate conductor comprises a first material and the electrode comprises a second material. 
     
     
         13 . The method of  claim 12 , wherein the first material consists essentially of at least one of the following: tantalum, platinum, gold, iridium, rhenium, tungsten, ruthenium, depleted uranium, cobalt, chromium, titanium, aluminum, vanadium, chromium, nickel, molybdenum, iron, copper, silver, gold, stainless steel, magnesium-nickel, palladium and alloys thereof. 
     
     
         14 . The method of  claim 12 , wherein the first material consists essentially of a cobalt-based alloy. 
     
     
         15 . The method of  claim 12 , wherein the second material consists essentially of at least one of the following: tantalum, platinum, gold, iridium, rhenium, tungsten, ruthenium, depleted uranium, cobalt, chromium, titanium, aluminum, vanadium, chromium, nickel, molybdenum, iron, copper, silver, gold, stainless steel, magnesium-nickel, palladium and alloys thereof. 
     
     
         16 . The method of  claim 12 , wherein the second material consists essentially of a tantalum alloy. 
     
     
         17 . The method of  claim 9 , further comprising providing an opening through the first insulative layer in proximity to the predetermined location prior to positioning the electrode. 
     
     
         18 . The method of  claim 17 , wherein providing the opening comprises forming the opening by means of mechanical cutting. 
     
     
         19 . The method of  claim 17 , wherein providing the opening comprises forming the opening by means of thermal cutting. 
     
     
         20 . The method of  claim 9 , wherein coupling the electrode comprises melting the elongate conductor and manipulating the molten substance to cover a portion of the electrode.