US2012222730A1PendingUtilityA1
Tandem solar cell with improved absorption material
Est. expiryMar 1, 2031(~4.6 yrs left)· nominal 20-yr term from priority
C23C 14/34Y02E10/548H10F 71/10H10F 71/00H10F 10/172H10F 10/19H10F 77/128Y02E10/541
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Claims
Abstract
A photosensitive device and method includes a top cell having an N-type layer, a P-type layer and a top intrinsic layer therebetween. A bottom cell includes an N-type layer, a P-type layer and a bottom intrinsic layer therebetween. The bottom intrinsic layer includes a Cu—Zn—Sn containing chalcogenide.
Claims
exact text as granted — not AI-modified1 . A photosensitive device, comprising:
a top cell having an N-type layer, a P-type layer and a top intrinsic layer therebetween; and a bottom cell having an N-type layer, a P-type layer and a bottom intrinsic layer therebetween, the bottom intrinsic layer including a Cu—Zn—Sn containing chalcogenide.
2 . The device as recited in claim 1 , wherein the Cu—Zn—Sn containing chalcogenide is a compound with a kesterite structure of the formula: Cu 2-x Zn 1+y Sn(S 1-z Se z ) 4+q wherein 0≦x≦1; 0≦y≦1; 0≦z≦1; −1≦q≦1.
3 . The device as recited in claim 1 , wherein the bottom intrinsic layer includes a deposited ink material.
4 . The device as recited in claim 1 , wherein the bottom cell includes a high-work-function metal as the P-type layer.
5 . The device as recited in claim 4 , wherein the high-work-function metal includes molybdenum.
6 . The device as recited in claim 5 , wherein the molybdenum is formed on a glass substrate.
7 . The device as recited in claim 1 , wherein the bottom cell includes a layer of cadmium sulfide as the N-type layer.
8 . The device as recited in claim 1 , wherein the top cell includes amorphous silicon as the top intrinsic layer.
9 . The device as recited in claim 1 , wherein the top cell includes doped amorphous silicon as the N-type layer and includes doped microcrystalline silicon as the P-type layer.
10 . A photosensitive device, comprising:
a top cell having an N-type layer, a P-type layer and a top intrinsic layer therebetween; and a bottom cell having an N-type layer, a P-type layer and a bottom intrinsic layer therebetween, the bottom intrinsic layer including a Cu—Zn—Sn containing chalcogenide compound with a kesterite structure of the formula: Cu 2-x Zn 1+y Sn(S 1-z Se z ) 4+q wherein 0≦x≦1; 0≦y≦1; 0≦z≦1; =1≦q≦1, wherein z is controlled to adjust a band gap of the bottom cell to be lower than a band gap of the top cell.
11 . The device as recited in claim 10 , wherein the top cell includes amorphous silicon as the top intrinsic layer.
12 . The device as recited in claim 10 , wherein the top cell includes doped amorphous silicon as the N-type layer and includes doped microcrystalline silicon as the P-type layer.
13 . The device as recited in claim 10 , wherein the bottom intrinsic layer includes a deposited ink material.
14 . The device as recited in claim 10 , wherein the bottom cell includes a layer of cadmium sulfide as the N-type layer.
15 . A method for fabrication of a tandem photovoltaic device, comprising:
forming a bottom cell having an N-type layer, a P-type layer and a bottom intrinsic layer therebetween, wherein the bottom intrinsic layer includes a Cu—Zn—Sn containing chalcogenide; and forming a top cell over the bottom cell to form a tandem cell, the top cell having an N-type layer, a P-type layer and a top intrinsic layer therebetween.
16 . The method as recited in claim 15 , wherein the Cu—Zn—Sn containing chalcogenide includes a kesterite structure of a formula: Cu 2-x Zn 1+y Sn(S 1-z Se z ) 4+q wherein 0≦x≦1; 0≦y≦1; 0≦z≦1; −1≦q≦1.
17 . The method as recited in claim 16 , further comprising adjusting z to control a band gap of the bottom intrinsic layer such that the band gap of the bottom cell is lower than a band gap of the top cell.
18 . The method as recited in claim 15 , wherein the bottom cell includes molybdenum as the P-type layer formed on a glass substrate.
19 . The method as recited in claim 15 , wherein the bottom cell includes a layer of cadmium sulfide as the N-type layer.
20 . The method as recited in claim 15 , wherein the top cell includes amorphous silicon as the top intrinsic layer.
21 . The method as recited in claim 15 , wherein the top cell includes doped amorphous silicon as the N-type layer and includes doped microcrystalline silicon as the P-type layer.
22 . The method as recited in claim 15 , wherein the bottom intrinsic layer is formed by a coating process.
23 . The method as recited in claim 22 , wherein the coating process is performed in less than one minute.
24 . The method as recited in claim 22 , wherein the coating process includes an ink deposition.
25 . The method as recited in claim 22 , wherein the coating process includes one of sputtering, electroplating or spin-coating.Cited by (0)
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