Insulating layer for rigid printed circuit boards

Abstract

One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs.

1 . A method of manufacturing printed circuit boards, the method comprising:
 providing a component comprising a first surface of a strain resistant cap layer engaging a first surface of a conductive layer, wherein the strain resistant cap layer comprises polyimide; and   attaching the component a stack of laminates by attaching a second surface of the strain resistant cap layer to a top surface of a first layer of the stack of laminates, wherein the stack of laminates comprises at least one rigid insulating layer extending throughout the entire length of the printed circuit board to define the printed circuit board comprising entirely rigid portions.   
     
     
         2 . The method of  claim 1 , wherein providing the component further comprises providing a discardable layer engaging a second surface of the conductive layer. 
     
     
         3 . The method of  claim 2 , further comprising releasing the discardable layer from the component, wherein the second surface of the conductive layer becomes a surface conductive layer. 
     
     
         4 . The method of  claim 1 , further comprising mounting an electronic device on the rigid printed circuit board to form a rigid printed circuit board assembly. 
     
     
         5 . The method of  claim 1 , wherein the conductive layer comprises rolled-annealed copper. 
     
     
         6 . The method of  claim 1 , wherein the conductive layer comprises electrodeposited copper. 
     
     
         7 . The method of  claim 1 , wherein providing the component comprises providing the strain resistant cap layer comprising at least two of the following characteristics: ductility in the range of about 20-80%; Tg in range of about 220-420° C.; and tensile strength in the range of about 10,000-50,000 psi. 
     
     
         8 . The method of  claim 1 , wherein the strain resistant cap layer is substantially free of materials selected from the group of: halogen, fiberglass, and lead. 
     
     
         9 . The method of  claim 1 , wherein the component is fully cured. 
     
     
         10 . The method of  claim 1 , wherein the component comprises pre-formed layers of the conductive layer and the strain resistant cap layer. 
     
     
         11 . The method of  claim 1 , wherein providing the component comprises attaching the conductive layer with the strain resistant cap layer using one of the following processes: cast to foil, vapor deposition, sputtering, and plating. 
     
     
         12 . A component for manufacturing rigid printed circuit boards, the component comprising:
 a conductive layer comprising a first surface and a second surface;   a discardable layer comprising a first surface, wherein the first surface of the discardable layer is attached to the first surface of the conductive layer; and   a strain resistant layer comprising a first surface, wherein the first surface of the strain resistant layer is attached to the second surface of the conductive layer, and wherein the strain resistant layer comprises at least two characteristics selected from a group of: ductility of at least about 15%, Tg of at least about 220° C., and tensile strength of at least about 10,000 psi.   
     
     
         13 . The component of  claim 12 , wherein the discardable layer comprises aluminum. 
     
     
         14 . The component of  claim 12 , wherein the strain resistant layer comprises polyimide. 
     
     
         15 . The component of  claim 12 , wherein the strain resistant layer comprises at least one characteristic selected from the group of: fully cured, substantially halogen free, non-glass reinforced, substantially lead free, and substantially fiberglass free. 
     
     
         16 . The component of  claim 12 , wherein the conductive layer comprises copper. 
     
     
         17 . The component of  claim 15 , wherein the conductive layer comprises rolled-annealed copper. 
     
     
         18 . The component of  claim 15 , wherein the conductive layer comprises electrodeposited copper. 
     
     
         19 . The component of  claim 12 , wherein the discardable layer comprises a second surface, and wherein the component further comprises:
 a second conductive layer comprising a first surface and a second surface, wherein the first surface of the second conductive layer is attached to the second surface of the discardable layer; and   a second strain resistant layer comprising a first surface, wherein the first surface of the second strain resistant layer is attached to the second surface of the second conductive layer.   
     
     
         20 . The component of  claim 19 , wherein the second strain resistant comprises at least two of the following characteristics: ductility in the range of about 20-80%; Tg in the range of about 220-420° C.; tensile strength in the range of about 10,000-50,000 psi; and CTE X,Y of about 40 ppm/° C. or less.