Printed circuit board and method of manufaturing the same

Abstract

Disclosed are a printed circuit board including a core substrate including core circuit layers on both sides thereof, a first build-up layer formed on one side of the core substrate, a second build-up layer formed on the other side of the core substrate, and first and second protective layers formed on the first and second build-up layers, respectively, wherein the first build-up layer includes a trench circuit layer as an outermost circuit layer formed by a trench technology, the trench circuit layer is embedded in the first protective layer, and an outermost circuit layer of the second build-up layer is embedded in an outermost insulating layer of the second build-up layer, and a method of manufacturing the printed circuit board. Thanks to the formation of the outermost circuit layer by the trench technology, it is difficult to separate the outermost circuit layer from the outermost insulating layer.

1 . A printed circuit board, comprising:
 a core substrate including core circuit layers on both sides thereof;   a first build-up layer formed on one side of the core substrate;   a second build-up layer formed on the other side of the core substrate; and   first and second protective layers formed on the first and second build-up layers, respectively,   wherein the first build-up layer includes a trench circuit layer as an outermost circuit layer formed by a trench-forming technology, the trench circuit layer is embedded in the first protective layer, and an outermost circuit layer of the second build-up layer is embedded in an outermost insulating layer of the second build-up layer.   
     
     
         2 . The printed circuit board as set forth in  claim 1 , further comprising a first bump for connecting the core circuit layer to an innermost circuit layer of the first build-up layer and a second bump for connecting the core circuit layer to an innermost circuit layer of the second build-up layer. 
     
     
         3 . The printed circuit board as set forth in  claim 2 , wherein both the first and second bumps are composed of metal plating layers or electroconductive metal paste. 
     
     
         4 . The printed circuit board as set forth in  claim 1 , wherein the first and second protective layers are each a solder resist layer. 
     
     
         5 . The printed circuit board as set forth in  claim 1 , wherein the first protective layer has a first opening through which a first pad of the trench circuit layer is exposed, and the second protective layer has a second opening through which a second pad of the outermost circuit layer of the second build-up layer is exposed. 
     
     
         6 . The printed circuit board as set forth in  claim 1 , wherein the first protective layer includes a bump pad which is connected at one side thereof to the trench circuit layer and is exposed to the outside at the other side thereof.