Mm-wave phased array antenna and system integration on semi-flex packaging

Abstract

Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Disclosed is an integrated multiple phased antenna array on a flexible substrate with one RFIC. In this way the module can be molded onto the contour of a platform such as a notebook or a hub of the personal area network or local area network. The multiple phased array can be 3D bent in a compact size to fit into thin mobile platforms. Different array antennas or antennas radiate in different spherical directions with beam scanning capabilities while driven simultaneously by one RFIC chip.

1 . A millimeter-wave (mm-wave) communications device, comprising:
 an antenna module comprising a plurality of mm-wave antennas on a substrate, wherein the substrate can be molded or bent to radiate in different spherical directions; and   an integrated circuit on the substrate connected to the plurality of mm-wave antennas through a transmission line;   wherein the integrated circuit is configured to communicate using mm-wave signals.   
     
     
         2 . The millimeter-wave communications device of  claim 1 , wherein the integrated circuit is selected from a group consisting of radio frequency integrated circuit (RFIC), baseband integrated circuit (BBIC), or a combination thereof. 
     
     
         3 . The millimeter-wave communications device of  claim 2 , wherein the transmission line connecting the plurality of mm-wave antennas is routed to equalize delays in the antenna module. 
     
     
         4 . The millimeter-wave communications device of  claim 2 , wherein the RFIC comprises a splitter to combine signals directed from the plurality of mm-wave antennas and to divide a signal into a plurality of signals to drive the antenna module. 
     
     
         5 . The millimeter-wave communications device of  claim 4 , wherein the integrated circuit is attached to the substrate by a technique selected from chip and wire assembly, chip-on-board assembly, or flip-chip assembly. 
     
     
         6 . The millimeter-wave communications device of  claim 5 , wherein the substrate is made from a material selected from a group consisting of liquid crystal polymer, Teflon, Low Temperature Co-fired Ceramic, alumina, antenna grade core materials and laminates, duroid, high-resistivity silicon or one or more other suitable substrates for mm-wave applications. 
     
     
         7 . The millimeter-wave communications device of  claim 6 , wherein the integrated circuit is anchored to a lower layer substrate selected from a group consisting of printed circuit board (PCB), glass fiber board (FR-4), temperature-resistant glass fiber board (FR-5), ceramic substrate, metal-core PCB (MCPCB), direct copper bonded (DCB) substrate, metal composite board, copper-coated aluminum board, and aluminum board. 
     
     
         8 . A communication system adapted to be installed in an electronic device to communicate with other electronic devices comprising:
 an interface adapted to transfer and to receive signals at a first frequency from an antenna module; and   the antenna module comprising:
 at least one antenna array comprising a plurality of mm-wave antennas on a substrate, wherein the substrate can be molded or bent to radiate in different spherical directions; 
 an integrated circuit on the substrate connected to the plurality of mm-wave antennas through a transmission line; 
 wherein the integrated circuit is configured to exchange signals between the interface and the antenna module, and to communicate with other electronic devices using mm-wave signals. 
   
     
     
         9 . The communication system of  claim 8 , wherein the integrated circuit is a radio frequency integrated circuit (RFIC) and wherein the interface is baseband integrated circuit (BBIC). 
     
     
         10 . The communication system of  claim 9 , wherein the transmission line connecting the plurality of mm-wave antennas is routed to equalize delays in the at least one antenna array. 
     
     
         11 . The communication system of  claim 9 , wherein the RFIC comprises a splitter to combine signals directed from the plurality of mm-wave antennas and to divide a signal into a plurality of signals to drive the plurality of mm-wave antennas. 
     
     
         12 . The communication system of  claim 11 , wherein the integrated circuit is attached to the substrate by a technique selected from chip and wire assembly, chip-on-board assembly, or flip-chip assembly. 
     
     
         13 . The communication system of  claim 12 , wherein the substrate is made from a material selected from a group consisting of liquid crystal polymer, Teflon, Low Temperature Co-fired Ceramic, alumina, antenna grade core materials and laminates, duroid, high-resistivity silicon or one or more other suitable substrates for mm-wave applications. 
     
     
         14 . The communication system of  claim 13 , wherein the integrated circuit is anchored to a lower layer substrate selected from a group consisting of printed circuit board (PCB), glass fiber board (FR-4), temperature-resistant glass fiber board (FR-5), ceramic substrate, metal-core PCB (MCPCB), direct copper bonded (DCB) substrate, metal composite board, copper-coated aluminum board, and aluminum board. 
     
     
         15 . A multipoint wireless communications device installed in an electronic device to communicate with other electronic devices comprising:
 a flexible substrate comprising an antenna module with a plurality of mm-wave antennas, wherein the flexible substrate comprises a pliable material that can be configured to alter the radiation pattern of the antenna array module; and   an integrated circuit on the flexible substrate connected to the plurality of mm-wave antennas through a transmission line;   wherein the integrated circuit is configured to communicate using mm-wave signals.   
     
     
         16 . The multipoint wireless communications device of  claim 15 , wherein the integrated circuit is selected from a group consisting of radio frequency integrated circuit (RFIC), baseband integrated circuit (BBIC), or a combination thereof. 
     
     
         17 . The multipoint wireless communications device of  claim 16 , wherein the transmission line connecting the plurality of mm-wave antennas is routed to equalize delays in the antenna array. 
     
     
         18 . The multipoint wireless communications device of  claim 16 , wherein the RFIC comprises a splitter to combine signals directed from the plurality of mm-wave antennas and to divide a signal into a plurality of signals to drive the antenna array. 
     
     
         19 . The multipoint wireless communications device of  claim 18 , wherein the integrated circuit is attached to the substrate by a technique selected from chip and wire assembly, chip-on-board assembly, or flip-chip assembly. 
     
     
         20 . The multipoint wireless communications device of  claim 19 , wherein the substrate is made from a material selected from a group consisting of liquid crystal polymer, Teflon, Low Temperature Co-fired Ceramic, alumina, antenna grade core materials and laminates, duroid, high-resistivity silicon or one or more other suitable substrates for mm-wave applications. 
     
     
         21 . The multipoint wireless communications device of  claim 20 , wherein the integrated circuit is anchored to a lower layer substrate selected from a group consisting of printed circuit board (PCB), glass fiber board (FR-4), temperature-resistant glass fiber board (FR-5), ceramic substrate, metal-core PCB (MCPCB), direct copper bonded (DCB) substrate, metal composite board, copper-coated aluminum board, and aluminum board.