Composite polycrystalline diamond body

Abstract

In this novel PDC cutter, diamond powders of different composition and/or different grain size, are distributed, shaped, and compacted with a novel pressing tool, in multiple stages, spatially arranged into different regions of the PDC diamond body, then HPHT sintered to form one PDC body with spatially varying hardness, toughness and thermal resistance more optimal for machining, drilling and/or cutting of hard rock and stone.

1 . A cutting apparatus, comprising;
 a first polycrystalline diamond portion bonded to a substrate at a substantially complementary first interface, the first polycrystalline diamond portion including a first section that is substantially cylindrical with a first diameter and a second section that is substantially cylindrical and isotonically decreases from the first diameter to a second diameter from the second end of a second section to the first end of the second section; and   a second polycrystalline diamond portion associated with the first polycrystalline diamond portion along a second substantially complementary interface that extends along the second section of the first polycrystalline diamond portion, the second polycrystalline diamond portion including diamond particles of a different size than the first portion.   
     
     
         2 . The cutting apparatus of  claim 1 , wherein the first polycrystalline diamond portion is comprised of diamond particles that are coarser in size compared to the diamond particles of the second polycrystalline diamond portion. 
     
     
         3 . The apparatus of  claim 1 , wherein the second polycrystalline diamond portion is substantially the geometry of an annular ring, wherein the thickness of the ring varies along the length of the second portion. 
     
     
         4 . The apparatus of  claim 3 , wherein the thickness of the ring varies at a substantially constant taper from the first end to the second end. 
     
     
         5 . The apparatus of  claim 4 , wherein the thickness of the ring varies at a taper of approximately 8-45 degrees off vertical. 
     
     
         6 . The apparatus of  claim 4 , wherein the thickness of the ring varies at a taper of approximately 15-25 degrees off vertical. 
     
     
         7 . The apparatus of  claim 3 , wherein the thickness of the ring varies at a substantially constant radius from the first end to the second end. 
     
     
         8 . The apparatus of  claim 1 , further comprising one or more chords of diamond particles that dissect at least a portion of a depth of the second diamond portion. 
     
     
         9 . The apparatus of  claim 8 , wherein two chords dissect at least a portion of the depth of the second section into four substantially equal sectors. 
     
     
         10 . A cutting apparatus, comprising;
 a first polycrystalline diamond portion bonded to a substrate at a substantially complementary first interface, the first polycrystalline diamond portion including a first section that is substantially cylindrical with a first diameter and a second section that is substantially cylindrical and isotonically decreases from the first diameter to a second diameter from the second end of a second section to the first end of the second section; and   a second polycrystalline diamond portion associated with the first polycrystalline diamond portion along a second substantially complementary interface that extends along the second section of the first polycrystalline diamond portion, the second polycrystalline diamond portion including diamond particles of a different size than the first portion; and   wherein the first polycrystalline diamond portion is comprised of diamond particles that are coarser in size compared to the diamond particles of the second polycrystalline diamond portion.   
     
     
         11 . The apparatus of  claim 10 , wherein the second polycrystalline diamond portion is substantially the geometry of an annular ring, wherein the thickness of the ring varies along the length of the second portion. 
     
     
         12 . The apparatus of  claim 11 , wherein the thickness of the ring varies at a substantially constant taper from the first end to the second end. 
     
     
         13 . The apparatus of  claim 12 , wherein the thickness of the ring varies at a taper of approximately 8-45 degrees off vertical. 
     
     
         14 . The apparatus of  claim 13 , wherein the thickness of the ring varies at a taper of approximately 15-25 degrees off vertical. 
     
     
         15 . The apparatus of  claim 11 , wherein the thickness of the ring varies at a substantially constant radius from the first end to the second end. 
     
     
         16 . The apparatus of  claim 10 , further comprising one or more chords of diamond particles that dissect at least a portion of a depth of the second diamond portion. 
     
     
         17 . The apparatus of  claim 16 , wherein two chords dissect at least a portion of the depth of the second section into four substantially equal sectors.