Chemical-mechanical polishing tool and method for preheating the same

Abstract

A chemical-mechanical polishing tool and a method for preheating the same are disclosed. The chemical-mechanical polishing tool includes: a polishing pad, a deionized water supply channel, a polishing slurry supply channel and a polishing pad conditioner; and the chemical-mechanical polishing tool further includes: a heating apparatus, adapted to heat DI water fed to the DI water supply channel; a temperature sensor, arranged close to the polishing pad to measure a temperature of the polishing pad; and a preheating control system, connected to the temperature sensor, and adapted to control the DI water supply channel to spray the heated DI water to the polishing pad, and when the temperature measured by the temperature sensor is equal to or higher than a predetermined temperature, to close the DI water supply channel, control the polishing slurry supply channel to spray polishing slurry to the polishing pad, and startup the polishing pad conditioner to dress the polishing pad. The invention can reduce the consumption of polishing consumables by the chemical-mechanical polishing tool during preheating, thereby reducing production cost.

1 . A chemical-mechanical polishing (CMP) tool, comprising: a polishing pad, a deionized (DI) water supply channel, a polishing slurry supply channel and a polishing pad conditioner, wherein, the CMP tool further comprises:
 a heating apparatus, adapted to heat DI water fed to the DI water supply channel;   a temperature sensor, arranged close to the polishing pad to measure a temperature of the polishing pad; and   a preheating control system, connected to the temperature sensor, and adapted to control the DI water supply channel to spray the heated DI water to the polishing pad, and when the temperature measured by the temperature sensor is equal to or higher than a predetermined temperature, to close the DI water supply channel, control the polishing slurry supply channel to spray polishing slurry to the polishing pad, and startup the polishing pad conditioner to dress the polishing pad.   
     
     
         2 . The CMP tool according to  claim 1 , wherein, the heating apparatus is adapted to heat the DI water to a temperature ranging from room temperature to 60° C. 
     
     
         3 . The CMP tool according to  claim 1 , wherein, a nozzle is arranged at an end of the DI water supply channel, and a baffle is arranged at an outlet of the nozzle. 
     
     
         4 . The CMP tool according to  claim 1 , wherein, the predetermined temperature ranges from room temperature to 60° C. 
     
     
         5 . The CMP tool according to  claim 1 , wherein, the preheating control system is adapted to control the polishing pad conditioner to dress the polishing pad for 20 s to 60 s. 
     
     
         6 . The CMP tool according to  claim 1 , wherein, the length of the polishing pad conditioner in a radial direction of the polishing pad is equal to or larger than a radius of the polishing pad. 
     
     
         7 . The CMP tool according to  claim 1 , wherein, the length of the polishing pad conditioner in a radial direction of the polishing pad is smaller than a radius of the polishing pad. 
     
     
         8 . The CMP tool according to  claim 7 , wherein, the preheating control system is adapted to control the polishing pad conditioner to move in a radial direction of the polishing pad, to realize dressing of the polishing pad. 
     
     
         9 . The CMP tool according to  claim 8 , wherein, the preheating control system is adapted to control the polishing pad conditioner to move in the radial direction of the polishing pad at a constant speed or a variable speed. 
     
     
         10 . The CMP tool according to  claim 1 , wherein, an electrically-controlled valve is arranged in the DI water supply channel and the polishing slurry supply channel, and the electrically-controlled valve is connected with the preheating control system and controlled by the preheating control system. 
     
     
         11 . A method for preheating a chemical-mechanical polishing (CMP) tool, the CMP tool comprising a polishing pad and a polishing pad conditioner, wherein, the method comprises:
 spraying heated deionized (DI) water to the polishing pad; and   when a temperature of the polishing pad is equal to or higher than a predetermined temperature, stopping spraying the DI water, spraying polishing slurry to the polishing pad and controlling the polishing pad conditioner to dress the polishing pad.   
     
     
         12 . The method for preheating a CMP tool according to  claim 11 , wherein, the heated DI water has a temperature ranging from room temperature to 60° C. 
     
     
         13 . The method for preheating a CMP tool according to  claim 11 , wherein, the predetermined temperature ranges from room temperature to 60° C. 
     
     
         14 . The method for preheating a CMP tool according to  claim 11 , wherein, the time of the polishing pad conditioner dressing the polishing pad ranges from 20 s to 60 s. 
     
     
         15 . The method for preheating a CMP tool according to  claim 11 , wherein, the length of the polishing pad conditioner in a radial direction of the polishing pad is equal to or larger than a radius of the polishing pad, and the polishing pad conditioner dressing the polishing pad comprises: pressing the polishing pad conditioner on the polishing pad, and driving the polishing pad to rotate. 
     
     
         16 . The method for preheating a CMP tool according to  claim 11 , wherein, the length of the polishing pad conditioner in a radial direction of the polishing pad is smaller than a radius of the polishing pad, and the polishing pad conditioner dressing the polishing pad comprises: pressing the polishing pad conditioner on the polishing pad, driving the polishing pad to rotate, and driving the polishing pad conditioner to move in a radial direction of the polishing pad. 
     
     
         17 . The method for preheating a CMP tool according to  claim 16 , wherein, the polishing pad conditioner moves in the radial direction of the polishing pad at a constant speed or a variable speed.