Computer and electronic cabinet cooling chamber

Abstract

A cooling chamber for computers and for electronic components includes a conductive chamber containing a low boiling point fluid. The components are mounted in the chamber to be bathed by the fluid. The heat energy developed by the components causes the fluid to reach a temperature above the boiling point thus forming bubbles. Bubble guide tubes guide the bubbles upwardly, and fluid confined in the tubes between the bubbles is moved (pushed) upwardly. The cumulative action of the bubbles will cause circulation of the fluid in the chamber thus circulating fluid flow around the electronic components and flow around the chamber. Cooling fins mounted on the exterior of the chamber dissipate the heat generated by the components.

1 . A computer and electronic cooling chamber for cooling a heat source such as a hot component or other hot spot on a circuit board, said chamber comprising
 a) an enclosed container;   b) a fluid having a selectable boiling point contained in said container;   c) heat sink means thermally coupled to a first section of said container;   d) inserting at least a portion of said heat source in said fluid to provide heat energy to said fluid for generating in a second section of said container spaced fluid bubbles;   e) mounting said container to enable said bubbles to move in said container;   f) said bubbles creating a pressure force for moving and stirring said fluid to circulate toward said second section of said container wherein said heat sink means are positioned; and   h) said heat sink means removing heat energy from said fluid.   
     
     
         2 . A cooling chamber for cooling an electronic heat source comprising
 a) an enclosed container;   b) a fluid having a selectable boiling point contained in said container;   c) heat sink means thermally coupled to a first section of said container;   d) thermally coupling said heat source to provide heat energy to said fluid for generating in a second section of said container spaced fluid bubbles with hot fluid between said bubbles;   e) mounting said container to enable said bubbles to rise up said container;   f) said rising bubbles moving said fluid between the bubbles in the direction of the rising bubbles and toward said second section of said container wherein said heat sink means are positioned; and   h) said heat sink means removing heat energy from said fluid.   
     
     
         3 . A passive heat transfer pump for cooling a source of heat comprising
 a) a closed tubular loop;   b) a fluid having a low boiling point contained in said tubular loop and flowable through said loop;   c) heat sink means thermally coupled to first sections of said loop;   d) thermally coupling said heat source to provide heat energy to said fluid for generating spaced fluid bubbles in a section of said tubular loop;   e) mounting said second section of said loop to enable said bubbles to rise up said second section of said tubular loop;   f) conforming the dimensions of said second section and the dimensions of said bubbles section to confine hot liquid in said spaces between rising bubbles;   g) said rising bubbles pushing and pumping said hot fluid through said second section of said loop toward said first section of said loop wherein said heat sink means are mounted; and   h) said heat sink means removing heat energy from said hot fluid.   
     
     
         4 . A heat dissipation assembly for circuit boards and IC chips utilizing a liquid cycling heat transfer pump comprising:
 a) a housing including heat concentrators for said assembly;   b) fluid retaining tubes within said assembly;   c) methylene chloride which has a low boiling point contained within said assembly;   d) said tubes forming fluid pathways;   e) means for mounting said housing adjacent a heat source;   f) said methylene chloride forming bubbles when heated above said boiling point;   g) positioning at least one of said tubes pathways to direct said bubbles to move upwardly away from said heat source;   h) said bubbles pushing methylene chloride toward at least one heat concentrator to remove heat from said methylene chloride; and   I) fluid return pathways for cycling said cooled methylene chloride back toward said heat source and repeating the cycle.