Process for assembling elements containing biological substances

Abstract

The present invention relates to a biomedical device for the distribution or containment of biological substances comprising at least two components assembled each other with an adhesive composition comprising a mixture of an acrylic adhesive composition and an epoxy adhesive composition, and particularly thermal or piezoelectric ejecting devices, and biochip microarray. The present invention also relates to a method for assembling a biomedical device comprising at least two components, wherein said process comprises the steps of (i) forming a film of an adhesive composition comprising a mixture of a (meth)acrylate adhesive composition and an epoxy adhesive composition on at least one surface of said at least two components, (ii) pre-curing said adhesive composition with an UV-blue radiation exposure able to substantially cure said (meth)acrylate adhesive composition without substantially curing said epoxy adhesive composition, (iii) contacting said at least one surface of said at least two components to be assembled, and (iv) completing the curing of said adhesive composition with an UV-blue radiation exposure.

1 . A biomedical device for the distribution or containment of biological substances comprising at least two components assembled each other with an adhesive composition comprising a mixture of a (meth)acrylate adhesive composition and an epoxy adhesive composition. 
     
     
         2 . The biomedical device according to  claim 1 , wherein said (meth)acrylate adhesive composition comprises at least one (meth)acrylate monomer selected from mono-, and multi-functional (meth)acrylate monomers. 
     
     
         3 . The biomedical device according to  claim 2 , wherein said monofunctional (meth)acrylate monomer is selected from the group consisting of (i) long- and short-chain alkyl (meth)acrylates; (ii) hydroxyalkyl (meth)acrylates; (iii) amino alkyl (meth)acrylates; (iv) alkoxyalkyl (meth)acrylates; (v) single and multi-ring cyclic aromatic or non-aromatic (meth)acrylates; (vi) glycol (meth)acrylates; (vii) various alkoxylated alkylphenol (meth)acrylates; and (viii) combinations thereof. 
     
     
         4 . The biomedical device according to  claim 2 , wherein said multi-functional (meth)acrylate monomer is selected from the group consisting of (i) di(meth)acrylates, (ii) tri(meth)acrylates, (iii) tetra(meth)acrylates, and mixtures thereof. 
     
     
         5 . The biomedical device according to  claim 1 , wherein said adhesive composition comprises from about 5% to about 45% by weight, preferably from about 10% to about 30% by weight, based upon the total weight of the composition, of said (meth)acrylate adhesive composition. 
     
     
         6 . The biomedical device according to  claim 1 , wherein said (meth)acrylate adhesive composition comprises at least one acrylate monomer selected from mono-, and multi-functional acrylate monomers. 
     
     
         7 . The biomedical device according to  claim 1 , wherein more than 50 mole % of the curable functional groups contained in said (meth)acrylate adhesive composition is cured when a 20 μm thick layer of said (meth)acrylate adhesive composition is exposed with an UV radiation providing an energy higher than 20 mJ/cm 2 , more preferably higher 30 mJ/cm 2 , and lower than 80 mJ/cm 2 , more preferably lower than 70 mJ/cm 2 . 
     
     
         8 . The biomedical device according to  claim 1 , wherein said epoxy adhesive composition comprises at least one polymerizable epoxy resin selected from the group consisting of condensation reaction products of epichlorohydrin and a polyhydric alcohol or polyhydric phenol, cycloalkyl oxide epoxy resins, epoxy resins derived from diolefin or polyolefin or a copolymer thereof, epoxy resins prepared by copolymerization of glycidyl methacrylate and a vinyl compound, and epoxy resins prepared from a glyceride of a high unsaturated fatty acid. 
     
     
         9 . The biomedical device according to  claim 8 , wherein said epoxy adhesive composition comprises at least one polymerizable epoxy resin selected from the group consisting of (i) cycloalkyl epoxy resins; (ii) glycidyl ethers of polyphenol epoxy resins; (iii) glycidyl ester epoxy resins; and mixture thereof. 
     
     
         10 . The biomedical device according to  claim 1 , wherein said adhesive composition comprises from about 30% to about 80% by weight, preferably from about 40% to about 70% by weight, based upon the total weight of said adhesive composition, of said epoxy adhesive composition. 
     
     
         11 . The biomedical device according to  claim 1 , wherein less than 50 mole % of the curable functional groups contained in said epoxy adhesive composition is cured when a 20 μm thick layer of said epoxy adhesive composition is exposed with an UV radiation providing an energy higher than 20 mJ/cm 2 , more preferably higher 30 mJ/cm 2 , and lower than 80 mJ/cm 2 , more preferably lower than 70 mJ/cm 2 . 
     
     
         12 . A method for assembling a biomedical device comprising at least two components, wherein said process comprises the steps of (i) forming a film of an adhesive composition comprising a mixture of a (meth)acrylate adhesive composition and an epoxy adhesive composition on at least one surface of said at least two components, (ii) pre-curing said adhesive composition with an UV-blue radiation exposure able to substantially cure said (meth)acrylate adhesive composition without substantially curing said epoxy adhesive composition, (iii) contacting said at least one surface of said at least two components to be assembled, and (iv) completing the curing of said adhesive composition with an UV-blue radiation exposure. 
     
     
         13 . The assembling method according to  claim 12 , wherein said film forming step (i) is made by spray coating techniques. 
     
     
         14 . The assembling method according to  claim 12 , wherein said adhesive composition has a viscosity lower than 100 cPoise. 
     
     
         15 . The assembling method according to  claim 12 , wherein said film forming step (i) is solvent-free. 
     
     
         16 . The assembling method according to  claim 12 , wherein said at least one surface is subjected to a plasma treatment prior to said film forming step (i). 
     
     
         17 . The assembling method according to  claim 16 , wherein said plasma treatment is conducted in the absence of oxygen with a plasma gas selected from the group consisting of saturated and unsaturated hydrocarbons, nitrogen-containing hydrocarbons, nitrogen, ammonia, hydrogen, and mixture thereof. 
     
     
         18 . The assembling method according to  claim 12 , wherein said film of said adhesive composition has a thickness ranging from 5 μm to 100 μm, preferably of 20 μm. 
     
     
         19 . The assembling method according to  claim 12 , wherein more than 50 mole % of the curable functional groups contained in said (meth)acrylate adhesive composition, preferably more than 70 mole %, and more preferably more than 80 mole %, is completely cured in said pre-curing step (ii). 
     
     
         20 . The assembling method according to  claim 12 , wherein less than 50 mole % of the curable functional groups contained in said epoxy adhesive composition, preferably less than 40 mole %, and more preferably less than 30 mole %, is completely cured in said pre-curing step (ii). 
     
     
         21 . The assembling method according to  claim 12 , wherein said pre-curing step (ii) is performed with an UV radiation exposure providing an energy higher than 20 mJ/cm 2 , more preferably higher 30 mJ/cm 2 , and lower than 80 mJ/cm 2 , more preferably lower than 70 mJ/cm 2 . 
     
     
         22 . The assembling method according to  claim 12 , wherein said contacting step (iii) is performed by thermocompression at a temperature ranging from 50° to 250° C., preferably from 60° to 150° C., and at a pressure ranging from 1 to 10 bar, preferably from 2 to 7 bar. 
     
     
         23 . The assembling method according to  claim 12 , wherein said curing step (iv) is performed with an UV radiation exposure providing an energy higher than 500 mJ/cm 2 , more preferably higher 1000 mJ/cm 2 , and lower than 3000 mJ/cm 2 , more preferably lower than 2000 mJ/cm 2 . 
     
     
         24 . Use of an adhesive composition comprising a mixture of a (meth)acrylate adhesive composition and an epoxy adhesive composition having the features of  claim 2  for assembling the components of a biomedical device for the distribution or containment of biological substances.