Pressuring module, pressuring apparatus, substrate bonding apparatus, substrate bonding method, and bonded substrate

Abstract

A pressuring module includes a stage having a mounting surface on which an object to be pressured is mounted; a plurality of pressure detecting sections that detect a pressure applied on the mounting surface; and a pressure varying section that varies a pressure distribution across a plane of the mounting surface, by differing a pressing force against the object to be pressured between a periphery and a central portion of the mounting surface in a plane direction of the mounting surface based on the pressure detected by the plurality of pressure detecting sections.

1 . A pressuring module comprising:
 a stage having a mounting surface on which an object to be pressured is mounted;   a plurality of pressure detecting sections that detect a pressure applied on the mounting surface; and   a pressure varying section that varies a pressure distribution across a plane of the mounting surface, by differing a pressing force against the object to be pressured between a periphery and a central portion of the mounting surface in a plane direction of the mounting surface based on the pressure detected by the plurality of pressure detecting sections.   
     
     
         2 . The pressuring module according to  claim 1 , wherein
 the pressure varying section forms either a convex pressure distribution highest at the central portion and decreasing towards the periphery, or a concave pressure distribution lowest at the central portion and increasing towards the periphery.   
     
     
         3 . The pressuring module according to  claim 1 , wherein
 the pressure varying section includes a hollow pressuring section having a bag-like form, whose inner pressure is adjusted by flowing in and out of a fluid from and to outside.   
     
     
         4 . The pressuring module according to  claim 3 , wherein
 the plurality of pressure detecting sections include first pressure detecting sections and second pressure detecting sections,   the first pressure detecting sections are provided on the hollow pressuring section,   the second pressure detecting sections are respectively provided on a circumferential portion which surrounds the hollow pressuring section, and   the pressure varying section includes a controller to control the fluid to enter or exist the hollow pressuring section, based on a difference between a pressure detected by the first pressure detecting sections and a pressure detected by the second pressure detecting sections.   
     
     
         5 . The pressuring module according to  claim 4 , further comprising:
 a first supporting column and a second supporting column for pressuring the stage, wherein   the first pressure detecting sections and the first supporting column are provided in a serial relation to each other on the hollow pressuring section, and   the second pressure detecting sections and the second supporting column are provided in a serial relation to each other on the circumferential portion.   
     
     
         6 . The pressuring module according to  claim 3 , wherein
 the plurality of pressure detecting sections are provided on the hollow pressuring section, and   the pressure varying section includes a controller to control the fluid to enter or exit the hollow pressuring section, based on a difference between a pressure detected by one of the pressure detecting sections and another of the pressure detecting sections.   
     
     
         7 . The pressuring module according to  claim 4 , wherein
 the controller controls the fluid to enter or exist the hollow pressuring section so that the difference between the pressure detected by the first pressure detecting sections and the pressure detected by the second pressure detecting sections is no greater than a predetermined value.   
     
     
         8 . The pressuring module according to  claim 7 , wherein
 the controller controls the fluid to enter or exist the hollow pressuring section so that the difference between the pressure detected by the first pressure detecting sections and the pressure detected by the second pressure detecting sections is zero.   
     
     
         9 . The pressuring module according to  claim 4 , wherein
 the controller controls the fluid to enter or exist the hollow pressuring section so that the pressure detected by the first pressure detecting sections is larger than the pressure detected by the second pressure detecting sections, for protruding a central portion of the stage more than a periphery of the stage.   
     
     
         10 . The pressuring module according to  claim 4 , wherein
 the controller controls the fluid to enter or exist the hollow pressuring section so that the pressure detected by the second pressure detecting sections is larger than the pressure detected by the first pressure detecting sections, for depressing a central portion of the stage more than a periphery of the stage.   
     
     
         11 . The pressuring module according to  claim 1 , wherein
 the pressure varying section includes a piezoelectric element.   
     
     
         12 . The pressuring module according to  claim 11 , comprising:
 a supporting column having one end installed on a surface opposite to the mounting surface, wherein   the pressure varying section includes a load cell installed on the other end of the supporting column, a pressing force applied to the stage being detected by the piezoelectric element via the supporting column, the load cell pressing the supporting column to apply a pressing force to the stage by supplying power to the piezoelectric element.   
     
     
         13 . The pressuring module according to  claim 12 , wherein
 each of the stages is provided with a plurality of the supporting columns and a plurality of the load cells.   
     
     
         14 . The pressuring module according to  claim 13 , wherein
 the plurality of load cells are controlled to evenly pressure the object to be pressured mounted on the stage.   
     
     
         15 . The pressuring module according to  claim 12 , wherein
 the load cell is mounted above an elevator.   
     
     
         16 . The pressuring module according to  claim 12 , further comprising:
 a heating module provided between the stage and the supporting column; and   a thermal reflector through which the supporting column penetrates.   
     
     
         17 . The pressuring module according to  claim 1 , further comprising:
 a plurality of supporting columns respectively provided for the plurality of pressure detecting sections, wherein   the stage is pressured via the plurality of supporting columns by adjusting an internal pressure of the pressure varying section.   
     
     
         18 . The pressuring module according to  claim 17 , wherein
 the pressure varying section includes a hollow pressuring section having a bag-like form, whose inner pressure is adjusted by controlling flowing in and out of a fluid from and to outside.   
     
     
         19 . The pressuring module according to  claim 17 , comprising:
 a heating section provided between the stage and the plurality of supporting columns, for heating the stage.   
     
     
         20 . The pressuring module according to  claim 19 , wherein
 the heating section is constituted by a plurality of heating blocks.   
     
     
         21 . The pressuring module according to  claim 20 , further comprising:
 a frame to support the plurality of heating blocks, wherein   each of the plurality of supporting columns is linked to the frame.   
     
     
         22 . The pressuring module according to  claim 21 , wherein
 the stage has a round shape, and the frame is formed radially from a center of the round shape.   
     
     
         23 . The pressuring module according to  claim 19 , further comprising:
 a thermal reflector between the pressure varying section and the heating section.   
     
     
         24 . The pressuring module according to  claim 23 , wherein
 the plurality of supporting columns penetrate the thermal reflector.   
     
     
         25 . The pressuring module according to  claim 24 , wherein
 a plurality of the thermal reflectors are provided to be distant from each other in an axial direction of the plurality of supporting columns.   
     
     
         26 . The pressuring module according to  claim 25 , further comprising:
 a thermal reflector oriented parallel to the axial direction.   
     
     
         27 . The pressuring module according to  claim 23 , wherein
 the thermal reflector is a metal plate.   
     
     
         28 . The pressuring module according to  claim 23 , wherein
 a multi-layer film is formed on a surface of the thermal reflector.   
     
     
         29 . The pressuring module according to  claim 28 , wherein
 the multi-layer film reflects a wavelength of radiation in a vicinity of a targeted heating temperature of the stage.   
     
     
         30 . The pressuring module according to  claim 1 , which stops pressuring when at least one of the plurality of pressure detecting sections has detected an abnormal pressure. 
     
     
         31 . A pressuring apparatus comprising pressuring modules according to  claim 1  provided to oppose each other. 
     
     
         32 . A substrate bonding apparatus comprising:
 a pressuring module according to  claim 1 , and   another stage provided to oppose the stage of the pressuring module, wherein   the substrate bonding apparatus bonds a plurality of substrates mounted between the stage of the pressuring module and the another stage.   
     
     
         33 . A substrate bonding method comprising:
 mounting a plurality of substrates between mounting surfaces of a pair of opposing stages;   detecting a pressure applied on the mounting surfaces using a plurality of pressure detecting sections; and   varying a pressure by varying a pressure distribution across a plane of the mounting surfaces, by differing a pressing force against an object to be pressured between a periphery and a central portion of the mounting surfaces in a plane direction of the mounting surfaces based on the pressure detected by the plurality of pressure detecting sections.   
     
     
         34 . The substrate bonding method according to  claim 33 , wherein
 varying the pressure includes forming either a convex pressure distribution highest at the central portion and decreasing towards the periphery, or a concave pressure distribution lowest at the central portion and increasing towards the periphery.   
     
     
         35 . The substrate bonding method according to  claim 33 , wherein
 varying the pressure includes varying a pressure distribution by means of a hollow pressuring section having a bag-like form, whose inner pressure is adjusted by flowing in and out of a fluid from and to outside.   
     
     
         36 . The substrate bonding method according to  claim 35 , wherein
 the plurality of pressure detecting sections include first pressure detecting sections and second pressure detecting sections,   the first pressure detecting sections are provided on the hollow pressuring section,   the second pressure detecting sections are respectively provided on a circumferential portion which surrounds the hollow pressuring section, and   varying the pressure includes controlling the fluid to enter or exist the hollow pressuring section, based on a difference between a pressure detected by the first pressure detecting sections and a pressure detected by the second pressure detecting sections.   
     
     
         37 . The substrate bonding method according to  claim 36 , wherein
 the first pressure detecting sections and a first supporting column for pressuring one of the stages are provided in a serial relation to each other on the hollow pressuring section, and   the second pressure detecting sections and a second supporting column for pressuring the one of the stages are provided in a serial relation to each other on the circumferential portion.   
     
     
         38 . The substrate bonding method according to  claim 35 , wherein
 the plurality of pressure detecting sections are provided on the hollow pressuring section, and   varying the pressure includes controlling the fluid to enter or exit the hollow pressuring section, based on a difference between a pressure detected by one of the pressure detecting sections and another of the pressure detecting sections.   
     
     
         39 . The substrate bonding method according to  claim 36 , wherein
 varying the pressure includes controlling the fluid to enter or exist the hollow pressuring section so that the difference between the pressure detected by the first pressure detecting sections and the pressure detected by the second pressure detecting sections is no greater than a predetermined value.   
     
     
         40 . The substrate bonding method according to  claim 39 , wherein
 varying the pressure includes controlling the fluid to enter or exist the hollow pressuring section so that the difference between the pressure detected by the first pressure detecting sections and the pressure detected by the second pressure detecting sections is zero.   
     
     
         41 . The substrate bonding method according to  claim 36 , wherein
 varying the pressure includes controlling the fluid to enter or exist the hollow pressuring section so that the pressure detected by the first pressure detecting sections is larger than the pressure detected by the second pressure detecting sections, for protruding a central portion of the stages more than a periphery of the stages.   
     
     
         42 . The substrate bonding method according to  claim 36 , wherein
 varying the pressure includes controlling the fluid to enter or exist the hollow pressuring section so that the pressure detected by the second pressure detecting sections is larger than the pressure detected by the first pressure detecting sections, for depressing a central portion of the stages more than a periphery of the stages.   
     
     
         43 . The substrate bonding method according to  claim 33 , wherein
 varying the pressure uses a piezoelectric element.   
     
     
         44 . The substrate bonding method according to  claim 43 , wherein
 one end of a supporting column is installed on a surface opposite to the mounting surfaces, wherein   a load cell is installed on the other end of the supporting column, a pressing force applied to the stages being detected by the piezoelectric element via the supporting column, the load cell pressing the supporting column to apply a pressing force to the stages by supplying power to the piezoelectric element.   
     
     
         45 . The substrate bonding method according to  claim 44 , wherein
 each of the stages is provided with a plurality of the supporting columns and a plurality of the load cells.   
     
     
         46 . The substrate bonding method according to  claim 45 , wherein
 the plurality of load cells are controlled to evenly pressure the object to be pressured mounted on the stages.   
     
     
         47 . The substrate bonding method according to  claim 44 , wherein
 the load cell is mounted above an elevator.   
     
     
         48 . The substrate bonding method according to  claim 44 , wherein
 a heating module is provided between the stage and the supporting column; and   a thermal reflector is provided through which the supporting column penetrates.   
     
     
         49 . The substrate bonding method according to  claim 33 , wherein
 a plurality of supporting columns are respectively provided for the plurality of pressure detecting sections, wherein   the stages are pressured via the plurality of supporting columns by adjusting an internal pressure in varying the pressure.   
     
     
         50 . The substrate bonding method according to  claim 49 , wherein
 varying the pressure uses a hollow pressuring section having a bag-like form, whose inner pressure is adjusted by controlling flowing in and out of a fluid from and to outside.   
     
     
         51 . The substrate bonding method according to  claim 49 , comprising:
 heating the stages by means of a heating section provided between the stage and the plurality of supporting columns.   
     
     
         52 . The substrate bonding method according to  claim 51 , wherein
 the heating section is constituted by a plurality of heating blocks.   
     
     
         53 . The substrate bonding method according to  claim 52 , wherein
 a frame to support the plurality of heating blocks is further provided, and   each of the plurality of supporting columns is linked to the frame.   
     
     
         54 . The substrate bonding method according to  claim 53 , wherein
 the stages have a round shape, and the frame is formed radially from a center of the round shape.   
     
     
         55 . The substrate bonding method according to  claim 51 , wherein
 a thermal reflector is provided.   
     
     
         56 . The substrate bonding method according to  claim 55 , wherein
 the plurality of supporting columns penetrate the thermal reflector.   
     
     
         57 . The substrate bonding method according to  claim 56 , wherein
 a plurality of the thermal reflectors are provided to be distant from each other in an axial direction of the plurality of supporting columns.   
     
     
         58 . The substrate bonding method according to  claim 57 , wherein
 a thermal reflector oriented parallel to the axial direction is further provided.   
     
     
         59 . The substrate bonding method according to  claim 55 , wherein
 the thermal reflector is a metal plate.   
     
     
         60 . The substrate bonding method according to  claim 56 , wherein
 a multi-layer film is formed on a surface of the thermal reflector.   
     
     
         61 . The substrate bonding method according to  claim 60 , wherein
 the multi-layer film reflects a wavelength of radiation in a vicinity of a targeted heating temperature of the stages.   
     
     
         62 . The substrate bonding method according to  claim 33 , which stops pressuring when at least one of the plurality of pressure detecting sections has detected an abnormal pressure. 
     
     
         63 . A bonded substrate resulting from a substrate bonding method according to  claim 33 .