Coated Electrical Assembly

Abstract

An electrical assembly which comprises a substrate and a conformal coating deposited on at least one surface of the substrate by plasma polymerization of a compound of formula (I) and deposition of a resulting polymer of the compound of formula (I), and plasma polymerization of a fluorohydrocarbon and deposition of a resulting polymer of the fluorohydrocarbon, such that the resulting polymer of the compound of formula (I) and the resulting polymer of the fluorohydrocarbon create discrete layers of the conformal coating; wherein the compound of formula (I) is an organic compound.

1 . An electrical assembly comprising:
 a substrate, the substrate comprising an insulating material, at least one conductive track present on at least one surface of the substrate, and at least one electrical component connected to at least one of the at least one conductive track; and   a conformal coating deposited on at least one surface of the substrate by:
 plasma polymerization of 1,4-dimethylbenzene and deposition of a resulting polymer of 1,4-dimethylbenzene onto the at least one surface of the substrate; and 
 plasma polymerization of C 3 F 6  and deposition of a resulting polymer of C 3 F 6  onto the resulting polymer of 1,4-dimethylbenzene; 
   wherein the conformal coating covers the at least one conductive track, the at least one electrical component, and the surface of the substrate on which the at least one conductive track and the at least one electrical component are located.   
     
     
         2 . An electrical assembly comprising:
 (a) a substrate   (b) a conformal coating deposited on at least one surface of the substrate by:
 plasma polymerization of a first compound of formula (I) and deposition of a resulting polymer of the first compound of formula (I) onto the at least one surface of the substrate; 
   
       
         
           
           
               
               
           
         
       
       wherein:
 R 1  represents C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
 R 2  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
 R 3  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
 R 4  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
 R 5  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; and 
 R 6  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; and
 plasma polymerization of a first fluorohydrocarbon and deposition of a resulting polymer of the first fluorohydrocarbon onto the resulting polymer of the first compound of formula (I). 
 
 
     
     
         3 . The electrical assembly of  claim 2 , further comprising:
 plasma polymerization of a second compound of formula (I) and deposition of a resulting polymer of the second compound of formula (I) onto the resulting polymer of the first fluorohydrocarbon; and   plasma polymerization of a second fluorohydrocarbon and deposition of a resulting polymer of the second fluorohydrocarbon onto the resulting polymer of the second compound of formula (I).   
     
     
         4 . The electrical assembly of  claim 2 , wherein the first compound of formula (I) is selected from the group consisting of 1,4-dimethylbenzene, 1,3-dimethylbenzene, 1,2-dimethylbenzene, toluene, 4-methyl styrene, 3-methyl styrene, 2-methyl styrene, 1,4-divinyl benzene, 1,3-divinyl benzene, and 1,2-divinyl benzene. 
     
     
         5 . The electrical assembly of  claim 2 , wherein the first fluorohydrocarbon is selected from the group consisting of CF 4 , C 2 F 4 , C 2 F 6 , C 3 F 6 , C 3 F 8 , and C 4 F 8 . 
     
     
         6 . The electrical assembly of  claim 2 , wherein the first compound of formula (I) is 1,4-dimethylbenzene and the first fluorohydrocarbon is C 3 F 6 . 
     
     
         7 . The electrical assembly of  claim 2 , wherein the substrate comprises an insulating material, at least one conductive track present on at least one surface of the substrate, and at least one electrical component connected to at least one of the at least one conductive track. 
     
     
         8 . The electrical assembly of  claim 2 , wherein the conformal coating covers the at least one conductive track, the at least one electrical component, and the surface of the substrate on which the at least one conductive track and the at least one electrical component are located. 
     
     
         9 . An electrical assembly comprising:
 (a) a substrate   (b) a conformal coating deposited on at least one surface of the substrate by
 plasma polymerization of a first fluorohydrocarbon and deposition of a resulting polymer of the first fluorohydrocarbon onto the at least one surface of the substrate, and 
 plasma polymerization of a first compound of formula (I) and deposition of a resulting polymer of the first compound of formula (I) onto the resulting polymer of the first fluorohydrocarbon; 
   
       
         
           
           
               
               
           
         
       
       wherein:
 R 1  represents C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
 R 2  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
 R 3  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
 R 4  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
 R 5  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; and 
 R 6  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl. 
 
     
     
         10 . The electrical assembly of  claim 9 , further comprising plasma polymerization of a second fluorohydrocarbon and deposition of a resulting polymer of the second fluorohydrocarbon onto the resulting polymer of the first compound of formula (I). 
     
     
         11 . The electrical assembly of  claim 9 , wherein the first compound of formula (I) is selected from the group consisting of 1,4-dimethylbenzene, 1,3-dimethylbenzene, 1,2-dimethylbenzene, toluene, 4-methyl styrene, 3-methyl styrene, 2-methyl styrene, 1,4-divinyl benzene, 1,3-divinyl benzene, and 1,2-divinyl benzene. 
     
     
         12 . The electrical assembly of  claim 9 , wherein the first fluorohydrocarbon is selected from the group consisting of CF 4 , C 2 F 4 , C 2 F 6 , C 3 F 6 , C 3 F 8 , and C 4 F 8 . 
     
     
         13 . The electrical assembly of  claim 9 , wherein the first compound of formula (I) comprises 1,4-dimethylbenzene and the first fluorohydrocarbon comprises C 3 F 6 . 
     
     
         14 . The electrical assembly of  claim 9 , wherein the substrate comprises an insulating material, at least one conductive track present on at least one surface of the substrate, and at least one electrical component connected to at least one of the at least one conductive track. 
     
     
         15 . The electrical assembly of  claim 9 , wherein the conformal coating covers the at least one conductive track, the at least one electrical component, and the surface of the substrate on which the at least one conductive track and the at least one electrical component are located. 
     
     
         16 . A method for conformally coating an electrical assembly, the method comprising:
 plasma polymerization of a first compound of formula (I) and deposition of a resulting polymer of the first compound of formula (I) onto at least one surface of an electrical assembly, and   plasma polymerization of a first fluorohydrocarbon and deposition of the resulting polymer of the first fluorohydrocarbon onto the resulting polymer of the first compound of formula (I);   
       
         
           
           
               
               
           
         
       
       wherein:
 R 1  represents C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
 R 2  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
 R 3  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
 R 4  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
 R 5  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; and 
 R 6  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl. 
 
     
     
         17 . The method of  claim 16 , further comprising:
 plasma polymerization of a second compound of formula (I) and deposition of a resulting polymer of the second compound of formula (1) onto the resulting polymer of the first fluorohydrocarbon; and   plasma polymerization of a second fluorohydrocarbon and deposition of a resulting polymer of the second fluorohydrocarbon onto the resulting polymer of the second compound of formula (I).   
     
     
         18 . The method of  claim 16 , wherein the first compound of formula (I) is selected from the group consisting of 1,4-dimethylbenzene, 1,3-dimethylbenzene, 1,2-dimethylbenzene, toluene, 4-methyl styrene, 3-methyl styrene, 2-methyl styrene, 1,4-divinyl benzene, 1,3-divinyl benzene, and 1,2-divinyl benzene. 
     
     
         19 . The method of  claim 16 , wherein the first fluorohydrocarbon is selected from the group consisting of CF 4 , C 2 F 4 , C 2 F 6 , C 3 F 6 , C 3 F 8 , and C 4 F 8 . 
     
     
         20 . The method of  claim 16 , wherein the first compound of formula (I) comprises 1,4-dimethylbenzene and the first fluorohydrocarbon comprises C 3 F 6 . 
     
     
         21 . The method of  claim 16 , in which the electrical assembly comprises a substrate, the substrate comprising an insulating material, at least one conductive track present on least one surface of the substrate, and at least one electrical component connected to at least one of the at least one conductive track. 
     
     
         22 . The method of  claim 21 , further comprising plasma polymerization of a compound of formula (I) and deposition of the resulting polymer onto the at least one conductive track, the at least one electrical component, and the surface of the substrate on which the at least one conductive track and the at least one electrical component are located. 
     
     
         23 . A method for conformally coating an electrical assembly, the method comprising:
 plasma polymerization of a first fluorohydrocarbon and deposition of a resulting polymer of the first fluorohydrocarbon onto at least one surface of the electrical assembly, and   plasma polymerization of a first compound of formula (I) and deposition of a resulting polymer of the first compound of formula (I) onto the resulting polymer of the first fluorohydrocarbon.   
       
         
           
           
               
               
           
         
       
       wherein:
 R 1  represents C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
 R 2  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
 R 3  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
 R 4  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
 R 5  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; and 
 R 6  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl. 
 
     
     
         24 . The method of  claim 23 , further comprising plasma polymerization of a second fluorohydrocarbon and deposition of a resulting polymer of the second fluorohydrocarbon onto the resulting polymer of the first compound of formula (I). 
     
     
         25 . The method of  claim 23 , wherein the first compound of formula (I) is selected from the group consisting of 1,4-dimethylbenzene, 1,3-dimethylbenzene, 1,2-dimethylbenzene, toluene, 4-methyl styrene, 3-methyl styrene, 2-methyl styrene, 1,4-divinyl benzene, 1,3-divinyl benzene, and 1,2-divinyl benzene. 
     
     
         26 . The method of  claim 23 , wherein the first fluorohydrocarbon is selected from the group consisting of CF 4 , C 2 F 4 , C 2 F 6 , C 3 F 6 , C 3 F 8 , and C 4 F 8 . 
     
     
         27 . The method of  claim 23 , wherein the first compound of formula (I) comprises 1,4-dimethylbenzene and the first fluorohydrocarbon comprises C 3 F 6 . 
     
     
         28 . The method of  claim 23 , in which the electrical assembly comprises a substrate, the substrate comprising an insulating material, at least one conductive track present on at least one surface of the substrate, and at least one electrical component connected to at least one of the at least one conductive track. 
     
     
         29 . The method of  claim 28 , further comprising plasma polymerization of a compound of formula (I) and deposition of the resulting polymer onto the at least one conductive track, the at least one electrical component, and the surface of the substrate on which the at least one conductive track and the at least one electrical component are located. 
     
     
         30 . An electrical assembly comprising:
 (a) a substrate   (b) a conformal coating deposited on at least one surface of the substrate by:
 plasma polymerization of a first compound of formula (I) and deposition of a resulting polymer of the first compound of formula (I), and plasma polymerization of a first fluorohydrocarbon and deposition of a resulting polymer of the first fluorohydrocarbon, such that the resulting polymer of the first compound of formula (I) and the resulting polymer of the first fluorohydrocarbon create discrete layers of the conformal coating; wherein: 
   
       
         
           
           
               
               
           
         
         R 1  represents C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
         R 2  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
         R 3  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
         R 4  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
         R 5  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; and 
         R 6  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl. 
       
     
     
         31 . A method for applying a conformal coating to an electrical assembly, the method comprising:
 plasma polymerization of a first compound of formula (I) and deposition of a resulting polymer of the first compound of formula (I), and plasma polymerization of a first fluorohydrocarbon and deposition of the resulting polymer of the first fluorohydrocarbon, wherein the resulting polymer of the first compound of formula (I) and the resulting polymer of the first fluorohydrocarbon create discrete layers within the conformal coating; and wherein:   
       
         
           
           
               
               
           
         
         R 1  represents C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
         R 2  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
         R 3  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
         R 4  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; 
         R 5  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl; and 
         R 6  represents hydrogen, C 1 -C 3  alkyl or C 2 -C 3  alkenyl.