US2012261095A1PendingUtilityA1
Thermal module structure and manufacturing method thereof
Est. expiryApr 12, 2031(~4.7 yrs left)· nominal 20-yr term from priority
Inventors:Chun-Ming Wu
Y10T29/49353F28D 15/0275F28F 2255/143F28F 21/06
39
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A thermal module structure and a manufacturing method thereof. The thermal module includes a plastic layer and at least one heat pipe. The plastic layer has at least one channel and multiple locking sections. The heat pipe is disposed in the channel. The locking sections are locked on a heat source to assemble the thermal module with the heat source. The heat pipe serves to conduct the heat generated by the heat source. Due to the plastic layer, the thermal module as a whole has a much lighter weight and is manufactured at lower material cost.
Claims
exact text as granted — not AI-modified1 . A thermal module structure comprising:
a plastic layer formed with at least one channel, the channel having a closed side and an open side; and at least one heat pipe having a heat absorption end and a heat dissipation end, the heat absorption end having a contact face corresponding to the open side and an inlay face correspondingly connected to the closed side.
2 . The thermal module structure as claimed in claim 1 , wherein the plastic layer has a bottom face.
3 . The thermal module structure as claimed in claim 1 , further comprising a metal layer inlaid in the plastic layer.
4 . The thermal module structure as claimed in claim 3 , wherein the metal layer is disposed between the plastic layer and the heat pipe.
5 . The thermal module structure as claimed in claim 3 , wherein the plastic layer is disposed on one side of the heat pipe, while the metal layer is disposed on the other side of the heat pipe.
6 . The thermal module structure as claimed in claim 1 , wherein the plastic layer is further formed with at least one locking section.
7 . The thermal module structure as claimed in claim 3 , wherein the metal layer has at least one locking section exposed to outer side of the plastic layer.
8 . The thermal module structure as claimed in claim 1 , wherein the plastic layer is integrally formed by means of plastic injection molding.
9 . A manufacturing method of a thermal module, comprising steps of:
providing at least one heat pipe; forming a plastic layer on the heat pipe; and coating the heat absorption end of the heat pipe with the plastic layer to form an open side corresponding to a contact face of the heat absorption end.
10 . The manufacturing method of the thermal module as claimed in claim 9 , wherein in the step of forming the plastic layer, at least one locking section is formed on a lateral side of the plastic layer.
11 . The manufacturing method of the thermal module as claimed in claim 9 , wherein in the step of forming the plastic layer, the plastic layer is formed with a bottom face on one side of the heat pipe.
12 . The manufacturing method of the thermal module as claimed in claim 9 , wherein in the step of forming the plastic layer, a metal layer is further disposed on one side of the heat pipe.
13 . The manufacturing method of the thermal module as claimed in claim 12 , wherein the metal layer is disposed between the plastic layer and the heat pipe.
14 . The manufacturing method of the thermal module as claimed in claim 12 , wherein the metal layer is positioned on the bottom face of the plastic layer.
15 . The manufacturing method of the thermal module as claimed in claim 12 , wherein the metal layer is exposed to outer side of the plastic layer and has at least one locking section.
16 . The manufacturing method of the thermal module as claimed in claim 9 , wherein the plastic layer is integrally formed by means of plastic injection molding.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.