Cooling apparatuses and power electronics modules comprising the same

Abstract

Cooling apparatuses and power electronics modules with cooling apparatuses are disclosed. In one embodiment, a cooling apparatus includes a heat transfer plate having a heat output surface and a periodic fractal pattern formed in the heat output surface. The periodic fractal pattern increases the surface area of the heat output surface and provides vapor bubble nucleation sites. An enclosure encloses the heat transfer plate and forms a fluid chamber between the enclosure and the heat transfer plate. A fluid source is fluidly coupled to the fluid chamber and provides cooling fluid to the fluid chamber. When the heat transfer plate is thermally coupled to the heat source, the heat source heats the transfer plate which vaporizes the cooling fluid in the fluid chamber thereby dissipating the heat of the heat source.

1 . A cooling apparatus for a heat source, the cooling apparatus comprising:
 a heat transfer plate comprising a heat output surface and a periodic fractal pattern formed in the heat output surface, the periodic fractal pattern increasing a surface area density of the heat output surface and providing vapor bubble nucleation sites;   an enclosure enclosing at least the heat output surface of the heat transfer plate, the enclosure forming a fluid chamber between the enclosure and the heat output surface of the heat transfer plate; and   a fluid source fluidly coupled to the fluid chamber, the fluid source providing cooling fluid to the fluid chamber, wherein, when the heat transfer plate is thermally coupled to the heat source, the heat source heats the transfer plate which vaporizes the cooling fluid in the fluid chamber thereby dissipating the heat of the heat source.   
     
     
         2 . The cooling apparatus of  claim 1 , wherein the periodic fractal pattern comprises a plurality of fractal units, each fractal unit having a length from about 100 nm to about 500 nm and a width from about 100 nm to about 500 nm. 
     
     
         3 . The cooling apparatus of  claim 1 , wherein the periodic fractal pattern has a depth less than or equal to about 500 nm. 
     
     
         4 . The cooling apparatus of  claim 2 , wherein each of the plurality of fractal units comprises a plurality of fractal sub-units. 
     
     
         5 . The cooling apparatus of  claim 4 , wherein the plurality of fractal units are interconnected. 
     
     
         6 . The cooling apparatus of  claim 4 , wherein the plurality of fractal units are not interconnected. 
     
     
         7 . The cooling apparatus of  claim 1 , further comprising a vapor condenser coupled to the fluid chamber and the fluid source, the vapor condenser condensing cooling fluid vapor in the fluid chamber and returning the cooling fluid to the fluid source. 
     
     
         8 . The cooling apparatus of  claim 1 , further comprising a fluid manifold coupled to the fluid source, the fluid manifold comprising at least one fluid jet positioned to direct the cooling fluid into the fluid chamber, wherein the at least one fluid jet emits a cooling fluid stream onto the periodic fractal pattern of the heat transfer plate. 
     
     
         9 . The cooling apparatus of  claim 8 , wherein the at least one fluid jet is a single fluid jet and the cooling fluid stream from the single fluid jet impacts the heat output surface at a center of the periodic fractal pattern. 
     
     
         10 . The cooling apparatus of  claim 1 , wherein the cooling fluid is pooled in the fluid chamber on the heat output surface of the heat transfer plate. 
     
     
         11 . The cooling apparatus of  claim 1 , wherein the heat source is a power electronics module coupled to a heat input surface of the heat transfer plate. 
     
     
         12 . A power electronics module comprising:
 a heat transfer plate comprising a heat input surface, a heat output surface, and a periodic fractal pattern formed in the heat output surface, the periodic fractal pattern increasing a surface area density of the heat output surface and providing vapor bubble nucleation sites;   a power electronics device thermally coupled to the heat input surface of the heat transfer plate;   an enclosure enclosing at least the heat output surface of the heat transfer plate, the enclosure forming a fluid chamber between the enclosure and the heat output surface of the heat transfer plate;   a vapor condenser coupled to the fluid chamber; and   a fluid source fluidly coupled to the fluid chamber, the fluid source providing cooling fluid to the fluid chamber, wherein, the power electronics device heats the heat transfer plate which vaporizes the cooling fluid in the fluid chamber thereby dissipating the heat of the power electronics device and the vapor condenser condenses cooling fluid vapor in the fluid chamber and returns the cooling fluid to the fluid source.   
     
     
         13 . The power electronics module of  claim 12 , wherein the periodic fractal pattern comprises a plurality of fractal units, each fractal unit having a length from about 100 nm to about 500 nm, a width from about 100 nm to about 500 nm and a depth from about 250 nm to about 500 nm. 
     
     
         14 . The power electronics module of  claim 13 , wherein the plurality of fractal units are interconnected. 
     
     
         15 . The power electronics module of  claim 13 , wherein the plurality of fractal units are not interconnected. 
     
     
         16 . The power electronics module of  claim 12 , further comprising a fluid manifold coupled to the fluid source, the fluid manifold comprising at least one fluid jet disposed in the fluid chamber, wherein the at least one fluid jet emits a cooling fluid stream onto the periodic fractal pattern of the heat transfer plate. 
     
     
         17 . The power electronics module of  claim 12 , wherein the at least one fluid jet is a single fluid jet and the cooling fluid stream from the single fluid jet impacts the heat output surface at a center of the periodic fractal pattern. 
     
     
         18 . The power electronics module of  claim 12 , wherein the cooling fluid is pooled in the fluid chamber on the heat output surface of the heat transfer plate. 
     
     
         19 . A cooling apparatus for a power electronics module, the cooling apparatus comprising:
 a heat transfer plate comprising a periodic fractal pattern, the periodic fractal pattern comprising a plurality of fractal units, each fractal unit having a depth less than or equal to about 500 nm, the periodic fractal pattern increasing a surface area of the heat transfer plate and providing vapor bubble nucleation sites;   an enclosure enclosing at least a heat output surface of the heat transfer plate, the enclosure forming a fluid chamber between the enclosure and the heat output surface of the heat transfer plate;   a vapor condenser coupled to the fluid chamber; and   a fluid source fluidly coupled to the fluid chamber, the fluid source providing cooling fluid to the fluid chamber, wherein a power electronics device of the power electronics module thermally coupled to the heat transfer plate heats the heat transfer plate which vaporizes the cooling fluid in the fluid chamber thereby dissipating the heat of the power electronics device and the vapor condenser condenses cooling fluid vapor in the fluid chamber and returns the cooling fluid to the fluid source.   
     
     
         20 . The cooling apparatus of  claim 19 , wherein each fractal unit of the plurality of fractal units has a length from about 100 nm to about 500 nm and a width from about 100 nm to about 500 nm.