Printed circuit board and method of fabricating the same

Abstract

Disclosed is a printed circuit board, which includes an insulating member having a circuit pattern embedded in one surface thereof, a build-up layer formed on one surface of the insulating member and including a build-up insulating layer and a circuit layer formed in the build-up insulating layer and having a via connected to the circuit pattern, and a solder resist layer formed on the build-up layer. A method of fabricating the printed circuit board is also provided. The printed circuit board is fabricated using a build-up process and the outermost circuit layer thereof is formed to have an embedded structure using an imprinting process, thus minimizing the separation of the circuit layer and reducing the lead time and the fabrication cost.

1 . A printed circuit board, comprising:
 an insulating member having a circuit pattern embedded in one surface thereof;   a build-up layer formed on one surface of the insulating member and including a build-up insulating layer and a circuit layer formed in the build-up insulating layer and having a via connected to the circuit pattern; and   a solder resist layer formed on the build-up layer.   
     
     
         2 . The printed circuit board as set forth in  claim 1 , wherein a pattern trench is formed in one surface of the insulating member using an imprinting process, and thus the circuit pattern is formed in the pattern trench. 
     
     
         3 . The printed circuit board as set forth in  claim 1 , wherein the insulating member has a bump pad, which is formed to be exposed to the other surface of the insulating member while being connected to the circuit pattern. 
     
     
         4 . The printed circuit board as set forth in  claim 3 , wherein a surface treatment layer is formed on an exposed surface of the bump pad. 
     
     
         5 . The printed circuit board as set forth in  claim 3 , wherein a pattern trench is formed in the insulating member and a bump pad trench is formed to pass through the insulating member, and thus the circuit pattern is formed in the pattern trench and the bump pad is formed in the bump pad trench. 
     
     
         6 . The printed circuit board as set forth in  claim 3 , wherein the insulating member has the bump pad connected to the circuit pattern, and an assistant pad which is formed to be exposed to the other surface of the insulating member while being connected to the bump pad and has a diameter larger than that of the bump pad. 
     
     
         7 . The printed circuit board as set forth in  claim 6 , wherein a surface treatment layer is formed on an exposed surface of the assistant pad. 
     
     
         8 . The printed circuit board as set forth in  claim 1 , wherein a first opening for exposing a first pad of the circuit layer is formed in the solder resist layer, and a second opening for exposing a second pad of the circuit pattern is formed in the insulating member.