Method of manufacturing conductive laminated film

Abstract

A manufacturing method of a conductive laminated film suppressing a wrinkle has a metal layer forming step in which a conductive metal layer is continuously formed on a surface of a long transparent conductive film where a transparent conductive layer is formed while the transparent conductive film, including a long transparent film base containing a polyester resin as a constituting material and the transparent conductive layer formed thereon, is transported. The metal layer forming step is performed under a reduced pressure atmosphere of 1 Pa or less. The long transparent conductive film is continuously transported by application of a transport tensile force, and the conductive metal layer is continuously deposited on the surface where the transparent conductive layer is formed in a state in which a surface where the transparent conductive layer is not formed contacts the surface of a film-forming roll.

1 . A method of manufacturing a long conductive laminated film comprising the steps of:
 preparing a long transparent conductive film including a long transparent film base containing a polyester resin as a constituting material and a transparent conductive layer formed thereon; and   continuously forming a conductive metal layer on a surface of the long transparent conductive film where the transparent conductive layer is formed while transporting the long transparent conductive film,   wherein   the metal layer forming step is performed under a reduced pressure atmosphere of 1 Pa or less,   the long transparent conductive film is continuously transported by application of a transport tensile force in the metal layer forming step,   the conductive metal layer is continuously deposited on the surface where the transparent conductive layer is formed in a state in which a surface of the transparent conductive film where the transparent conductive layer is not formed contacts the surface of a film-forming roll,   the surface temperature of the film-forming roll is 110 to 200° C., and   the transport tensile force per unit area in a plane perpendicular to the longitudinal direction of the film base in a region where the film is formed is 0.6 to 1.8 N/mm 2 .   
     
     
         2 . The method of manufacturing a conductive laminated film according to  claim 1 , wherein a transport tensile force per unit width is applied so as to satisfy the following formula wherein x (mm) represents the thickness of the film base in a region where the film is formed and y (N/mm) represents the transport tensile force per unit width:
   0.6x≦y≦1.8x.
   
     
     
         3 . The method of manufacturing a conductive laminated film according to  claim 1 , wherein the metal layer is formed by a sputtering method in the metal layer forming step. 
     
     
         4 . The method of manufacturing a conductive laminated film according to  claim 1 , wherein the deposition thickness of the conductive metal layer is 20 nm or more. 
     
     
         5 . The method of manufacturing a conductive laminated film according to  claim 1 , wherein the transparent conductive layer is a conductive oxide layer containing an indium-tin oxide as a main component. 
     
     
         6 . The method of manufacturing a conductive laminated film according to  claim 1 , wherein the conductive metal layer is made of one type or two types or more of metals selected from the group consisting of Ti, Si, Nb, In, Zn, Sn, Au, Ag, Cu, Al, Co, Cr, Ni, Pb, Pd, Pt, W, Zr, Ta, and Hf or an alloy containing these metals as a main component.