Method for production of transparent conductive film and touch panel therewith

Abstract

There is provided a transparent conductive film having a transparent conductor layer with a high level of pen input durability and high-temperature, high-humidity reliability. The transparent conductive film of the present invention is a transparent conductive film, comprising: a transparent film substrate; a transparent conductor layer that is provided on one side of the transparent film substrate and has a thickness d of 15 nm to 35 nm and an average surface roughness Ra of 0.37 nm to 1 nm; and at least a single layer of an undercoat layer interposed between the transparent film substrate and the transparent conductor layer.

1 . A method for manufacturing a transparent conductive film,
 wherein said transparent conductive film comprises:   a transparent film substrate;   a transparent conductor layer that is provided on one side of the transparent film substrate and has a thickness d of 15 nm to 35 nm and an average surface roughness Ra of 0.37 nm to 1 nm; and   a layer of an undercoat layer interposed between the transparent film substrate and the transparent conductor layer,   said method comprising:   forming a layer of an undercoat layer on one side of a transparent film substrate; and   forming a transparent conductor layer on the undercoat layer by sputtering a target under a discharge power condition of 4 W/cm 2  to 7 W/cm 2 .   
     
     
         2 . The method according to  claim 1 , further comprising performing annealing treatment to crystallize at a temperature of 120° C. to 160° C. after the step of forming the transparent conductor layer.