Cover tape and method for manufacture

Abstract

An article includes a cover tape, which includes a base film layer, tear enabling features, and an adhesive. The base film layer has opposed longitudinal edges and top and bottom surfaces. The tear enabling features are substantially parallel to the longitudinal edges and at the top and bottom surfaces.

1 . A method of making a cover tape, the method comprising:
 providing a base film layer having opposed longitudinal edges and upper and lower surfaces;   forming tear enabling features at the upper and lower surfaces of the base film layer substantially parallel to the longitudinal edges; and   applying an adhesive adjacent to the longitudinal edges and exterior to the tear enabling features.   
     
     
         2 . The method of  claim 1  further comprising forming recessed areas extending along the longitudinal edges and applying the adhesive on the recessed areas. 
     
     
         3 . The method of  claim 2 , wherein the step of forming the recessed areas comprises a process selected from the group consisting of scoring, extrusion, calendaring, micro-replication, laser ablation, ultrasound, chemical etching and stripping. 
     
     
         4 . The method of  claim 1  wherein the base film layer comprises two outer portions of laminated or coextruded materials separated by a central portion of material having a weaker cohesive force than adhesive force with the materials of the outer portions. 
     
     
         5 . The method of  claim 1  wherein the base film layer comprises two outer portions and a central portion of laminated or coextruded materials wherein each outer portion is separated from the central portion by a band of material having a weaker cohesive force than adhesive force with materials of the outer and central portions. 
     
     
         6 . The method of  claim 1 , wherein the step of forming tear enabling features comprises a process selected from the group consisting of scoring, extrusion, calendaring, micro-replication, laser ablation, ultrasound, die cutting, and chemical etching.