Vacuum pallet reflow

Abstract

A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.

1 . A soldering device, comprising:
 at least one soldering pallet assembly;   a first atmosphere configured within the soldering pallet assembly;   at least one solder element positioned within the first atmosphere, the solder element configured to attach an electrical component to an integrated circuit chip; and   a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere.   
     
     
         2 . The soldering device of  claim 1 , wherein the integrated circuit chip electrical component is attached to a substrate in the first atmosphere, the first atmosphere being a selectively applied negative pressure atmosphere. 
     
     
         3 . The soldering device of  claim 1 , further comprising a vacuum chamber, the vacuum chamber is selectively fluidly connected to the at least one soldering pallet assembly by a valve element, wherein the valve element is at least one of a manual valve that is physically rotated and an automatic temperature controlled valve that is automatically opened when exposed to a predetermined temperature. 
     
     
         4 . The soldering device of  claim 2 , further comprising a negative pressure generator selectively providing the negative pressure first atmosphere. 
     
     
         5 . The soldering device of  claim 1 , further comprising a soldering cavity, the soldering cavity is selectively configured with the first atmosphere, wherein the soldering cavity includes at least one mount for securing the integrated circuit chip. 
     
     
         6 . The soldering device of  claim 1 , wherein the pallet assembly includes at least one of a pallet cover, a pallet base and at least one negative pressure generator. 
     
     
         7 . The soldering device of  claim 1 , further comprising at least one thermocouple configured at least one of adjacent the pallet assembly and within the pallet assembly. 
     
     
         8 . The soldering device of  claim 6 , further comprising a sealing element configured between the pallet assembly cover and the pallet assembly base. 
     
     
         9 . The soldering device of  claim 1 , wherein the ambient atmosphere is an atmosphere inside a standard reflow oven. 
     
     
         10 . The soldering device of  claim 4 , wherein the negative pressure generator provides the negative pressure continuously to the soldering pallet assembly. 
     
     
         11 . The soldering device of  claim 1 , wherein the at least one electrical component is power device. 
     
     
         12 . The soldering device of  claim 11 , wherein the power device is a metal oxide semiconductor field-effect transistor, (MOSFET). 
     
     
         13 . A soldering system, comprising:
 at least one pallet assembly having a cover and a base;   at least one integrated circuit chip configured within the pallet assembly;   a vacuum source fluidly connected with the pallet assembly;   at least one solder element configured to attach at least one surface mount device to the integrated circuit chip;   a standard reflow oven having an ambient atmosphere, the oven configured to melt the solder element, thereby affixing the surface mount device to the integrated circuit chip.   
     
     
         14 . The soldering system of  claim 11 , wherein the vacuum source is selectively connected vacuum generator. 
     
     
         15 . The soldering system of  claim 11 , further comprising a filtration element fluidly connected to the vacuum source, the filtration element is configured to remove gases generated by the melting of the soldering element prior to introduction into a standard atmosphere. 
     
     
         16 . The soldering system of  claim 11 , further comprising at least one thermocouple configured adjacent the pallet assembly, the thermocouple provides a temperature measurement of the integrated circuit chip. 
     
     
         17 . The soldering system of  claim 16 , further comprising a valve, the valve fluidly connected to the vacuum source and the solder element, the valve is selectively opened to provide a negative pressure when an elevated heating condition occurs in the pallet assembly. 
     
     
         18 . A soldering method, comprising:
 providing at least one pallet assembly having a base and a cover;   inserting at least one integrated chip assembly into at least one of the base and the cover;   surrounding the integrated chip with a first atmosphere;   positioning the at least one pallet assembly within a standard reflow oven;   surrounding the pallet assembly with a second atmosphere, the second atmosphere is within the oven and is a different atmosphere than the first atmosphere; and   fusing the at least one electronic component to the substrate with a solder element.   
     
     
         19 . The soldering method of  claim 18 , further comprising elevating a temperature within the standard reflow oven. 
     
     
         20 . The soldering method of  claim 18 , further comprising activating at least one vacuum source, such that the first atmosphere is a negative pressure, the negative pressure is supplied during the operation of the standard reflow oven.