Light emitting diode package and method for fabricating the same

Abstract

The present disclosure provides an LED package and a method for fabricating the same. The LED package includes a base, at least one LED chip mounted on the base, a transparent wall disposed on the base and extending around the LED chip, and a fluorescent material disposed inside of the transparent wall and covering upper and side surfaces of the LED chip.

1 . A light emitting diode package, comprising:
 a base;   an LED chip mounted on the base;   a transparent wall disposed on the base and extending around the LED chip; and   a fluorescent material disposed inside of the transparent wall and covering upper and side surfaces of the LED chip,   
     
     
         2 . The LED package of  claim 1 , further comprising an encapsulation member disposed on the base and completely covering the transparent wall on the base. 
     
     
         3 . The LED package of  claim 2 , wherein the transparent wall comprises the same type of material as the encapsulation member. 
     
     
         4 . The LED package of  claim 1 , wherein the minimum distance between the transparent wall and the LED chip is the same as a the difference between the height of the transparent wall and the height of the LED chip, as measured from the base. 
     
     
         5 . The LED package of  claim 1 , wherein the transparent wall is a transfer molding formed on the base. 
     
     
         6 . The LED package of  claim 1 , wherein the transparent wall has an inclined interior side surface. 
     
     
         7 . A method of manufacturing a light emitting diode (LED) package, comprising:
 forming a transparent wall on a base to at least partially define a filling space;   mounting at least one LED chip inside the transparent wall; and   filling the filling space with a fluorescent material to cover the LED chip.   
     
     
         8 . The method of  claim 7 , wherein the transparent wall is formed on the base by transfer molding. 
     
     
         9 . The method of  claim 7 , further comprising connecting the LED chip to a bonding pad disposed on the base with a bonding wire, before filling the filling space. 
     
     
         10 . The method of  claim 7 , further comprising completely covering the transparent wall and the fluorescent material with an encapsulation member. 
     
     
         11 . A light emitting diode (LED) package comprising:
 a base;   an LED chip disposed on the base;   an opaque wall formed on the base and extending around the LED chip; and   a fluorescent material disposed inside of the opaque wall and covering upper and side surfaces of the LED chip.   
     
     
         12 . The LED package of  claim 11 , wherein the fluorescent material completely covers the LED chip. 
     
     
         13 . The LED package of  claim 1 , wherein the fluorescent material completely covers the LED chip. 
     
     
         14 . The method of  claim 7 , wherein the fluorescent material completely covers the LED chip. 
     
     
         15 . The LED package of  claim 1 , wherein the fluorescent material is coated on the LED chip to a substantially consistent thickness. 
     
     
         16 . The LED package of  claim 11 , wherein the fluorescent material is coated on the LED chip to a substantially consistent thickness. 
     
     
         17 . The LED package of  claim 1 , further comprising a plurality of the LED chips disposed inside of the transparent wall. 
     
     
         18 . The LED package of  claim 11 , further comprising a plurality of the LED chips disposed inside of the opaque wall. 
     
     
         19 . The LED package of  claim 11 , wherein inner side surfaces of the opaque wall are inclined with respect to the plane of the base.