Automatic handling system applied to many wafer processing devices

Abstract

An automatic handling system applied to many wafer processing devices includes a handling rail unit and a transport vehicle unit. The handling rail unit includes at least one handling rail. The transport vehicle unit includes a plurality of OHT vehicles disposed under the handling rail and mated with the handling rail, wherein each OHT vehicle includes at least one sliding portion slidably disposed on the handling rail, at least one rotatable portion for clamping at least one wafer carrier device, and at least one suspended portion connected between the sliding portion and the rotatable portion, wherein the wafer carrier device has a wafer pick-and-place opening, and the wafer carrier device is rotated by the rotatable portion of the OHT vehicle according to the position of the wafer processing device for adjusting the direction of the wafer pick-and-place opening to face the wafer processing device.

1 . An automatic handling system applied to many wafer processing devices, comprising:
 a handling rail unit including at least one handling rail, wherein the handling rail is disposed above the wafer processing devices and selectively crosses through the wafer processing devices; and   a transport vehicle unit including a plurality of OHT vehicles disposed under the handling rail and mated with the handling rail, wherein each OHT vehicle includes at least one sliding portion slidably disposed on the handling rail, at least one rotatable portion for clamping at least one wafer carrier device, and at least one suspended portion connected between the sliding portion and the rotatable portion, wherein the wafer carrier device has a wafer pick-and-place opening, and the wafer carrier device is rotated by the rotatable portion of the OHT vehicle according to the position of the wafer processing device for adjusting the direction of the wafer pick-and-place opening to face the wafer processing device.   
     
     
         2 . The automatic handling system as claimed in  claim 1 , wherein the wafer processing devices are divided into a first wafer processing unit and a second wafer processing unit, the first wafer processing unit includes a plurality of first wafer processing machines, the second wafer processing unit includes a plurality of second wafer processing machines, each first wafer processing machine includes a plurality of first placement areas disposed on the right side thereof, each second wafer processing machine includes a plurality of second placement areas disposed on the left side thereof, and the right side of the first wafer processing machine and the left side of the second wafer processing machine are two opposite sides. 
     
     
         3 . The automatic handling system as claimed in  claim 2 , wherein the handling rail crosses through the first placement areas of each first wafer processing machine and the second placement areas of each second wafer processing machine, wherein the wafer carrier device is rotated by the rotatable portion of the OHT vehicle according to the positions of the first wafer placement areas of the first wafer processing machine for adjusting the direction of the wafer pick-and-place opening to face the first placement area, and wafer carrier device is rotated by the rotatable portion of the OHT vehicle according to the positions of the second wafer placement areas of the second wafer processing machine for adjusting the direction of the wafer pick-and-place opening to face the second placement area. 
     
     
         4 . The automatic handling system as claimed in  claim 2 , wherein the first wafer processing machines and the second wafer processing machines are arranged alternately as a wavy shape, thus the first placement areas and the second placement areas are arranged as a straight line. 
     
     
         5 . The automatic handling system as claimed in  claim 1 , wherein the rotatable portion of each OHT vehicle for clamping the wafer carrier device is selectively rotated from 0 to 360 degrees. 
     
     
         6 . An automatic handling system applied to many wafer processing devices, comprising:
 a handling rail unit including at least one handling rail, wherein the handling rail is disposed above the wafer processing devices and selectively crosses through the wafer processing devices; and   a transport vehicle unit including a plurality of OHT vehicles disposed under the handling rail and mated with the handling rail, wherein each OHT vehicle includes at least one rotatable portion for clamping at least one wafer carrier device, the wafer carrier device has a wafer pick-and-place opening, and the wafer carrier device is rotated by the rotatable portion of the OHT vehicle according to the position of the wafer processing device for adjusting the direction of the wafer pick-and-place opening to face the wafer processing device.   
     
     
         7 . The automatic handling system as claimed in  claim 6 , wherein the wafer processing devices are divided into a first wafer processing unit and a second wafer processing unit, the first wafer processing unit includes a plurality of first wafer processing machines, the second wafer processing unit includes a plurality of second wafer processing machines, each first wafer processing machine includes a plurality of first placement areas disposed on the right side thereof, each second wafer processing machine includes a plurality of second placement areas disposed on the left side thereof, and the right side of the first wafer processing machine and the left side of the second wafer processing machine are two opposite sides. 
     
     
         8 . The automatic handling system as claimed in  claim 7 , wherein the handling rail crosses through the first placement areas of each first wafer processing machine and the second placement areas of each second wafer processing machine, wherein the wafer carrier device is rotated by the rotatable portion of the OHT vehicle according to the positions of the first wafer placement areas of the first wafer processing machine for adjusting the direction of the wafer pick-and-place opening to face the first placement area, and wafer carrier device is rotated by the rotatable portion of the OHT vehicle according to the positions of the second wafer placement areas of the second wafer processing machine for adjusting the direction of the wafer pick-and-place opening to face the second placement area. 
     
     
         9 . An automatic handling system applied to many wafer processing devices, comprising:
 a handling rail unit including at least one handling rail; and   a transport vehicle unit including a plurality of OHT vehicles disposed under the handling rail and mated with the handling rail, wherein each OHT vehicle includes at least one rotatable portion for clamping at least one wafer carrier device, wherein the wafer carrier device has a wafer pick-and-place opening, and the wafer carrier device is rotated by the rotatable portion of the OHT vehicle according to the position of the wafer processing device for adjusting the direction of the wafer pick-and-place opening to face the wafer processing device.   
     
     
         10 . The automatic handling system as claimed in  claim 9 , wherein the handling rail is disposed above the wafer processing devices and selectively crosses through the wafer processing devices, wherein each OHT vehicle includes at least one sliding portion slidably disposed on the handling rail and at least one suspended portion connected between the sliding portion and the rotatable portion.