Printed circuit board, display apparatus having a printed circuit board and method of manufacturing the printed circuit board

Abstract

A printed circuit board (“PCB”) includes a first pattern structure, a second pattern structure, a third pattern structure, and a fourth pattern structure. The first pattern structure includes a first ground pattern. The second pattern structure includes a first line pattern overlapping the first ground pattern and a second ground pattern electrically insulated from the first line pattern. The third pattern structure includes a third ground pattern overlapping the first line pattern and a second line pattern overlapping the second ground pattern. The fourth pattern structure includes a fourth ground pattern overlapping the second line pattern. Therefore, the PCB may decrease noise.

1 . A method of manufacturing a printed circuit board, the method comprising:
 forming a first pattern structure on a first surface of a first insulation substrate, the first pattern structure including a first ground pattern;   forming a second pattern structure on a second surface of the first insulation substrate opposite to the first surface, the second pattern structure including a first line pattern overlapping the first ground pattern and a second ground pattern electrically insulated from the first line pattern;   disposing a second insulation substrate on the second pattern structure;   forming a third pattern structure on the second insulation substrate, the third pattern structure including a second line pattern overlapping the second ground pattern and a third ground pattern electrically insulated from the second line pattern and overlapping the first line pattern;   disposing a third insulation substrate on the third pattern structure; and   forming a fourth pattern structure on the third insulation substrate, the fourth pattern structure including a fourth ground pattern overlapping the second line pattern.   
     
     
         2 . The method of  claim 1 , wherein the fourth pattern structure further comprises a third line pattern electrically insulated from the fourth ground pattern. 
     
     
         3 . The method of  claim 1 , wherein forming the fourth pattern structure on the third insulation substrate includes aligning the third line pattern such that it does not overlap the second line pattern. 
     
     
         4 . A method of manufacturing a printed circuit board, the method comprising:
 forming a first pattern structure on a first surface of a first insulation substrate, the first pattern structure including a first ground pattern;   forming a second pattern structure on a second surface of the first insulation substrate opposite to the first surface, the second pattern structure including a first line pattern overlapping the first ground pattern and a second ground pattern electrically insulated from the first line pattern;   forming a third pattern structure on a second insulation layer, the third pattern structure including a second line pattern and a third ground pattern;   forming a fourth pattern structure on a fourth insulation substrate, the fourth pattern structure including a fourth ground pattern;   disposing the second insulation substrate on the second pattern structure, so that the second line pattern and the third ground pattern respectively overlap the second ground pattern and the first line pattern, and the second insulation substrate is interposed between the second pattern structure and the third pattern structure; and   disposing the third insulation substrate on the third pattern structure, so that the fourth ground pattern overlaps the second line pattern and the third insulation substrate is interposed between the third pattern structure and the fourth pattern structure.