Hydrophobic Thermal Insulation

Abstract

Thermal insulation materials which have no binders in the form of liquids, which adhesively bond particles, and which are treated with low-volatility organosilanes or organosiloxanes whose boiling points are greater than 130° C. under atmospheric pressure, the k thermal conductivity being between 0.014 and 0.040 W/mK and the density being in the range from 50 to 300 kg/m 3 .

1 - 7 . (canceled) 
     
     
         8 . A thermal insulation material which does not contain any binders in the form of liquids which adhesively bond particles and has been treated with relatively nonvolatile organosilanes or organosiloxanes composed of building blocks of the general formulae
   (R 1   a X b SiO 1/2 )   (III-a)
     (R 1   2 SiO 2/2 )   (III-b)
     (R 1 SiO 3/2 )   (III-c)
     (R 1 R 2 SiO 2/2 )   (III-d)
     (SiO 4/2 )   (III-e)
   where the building blocks can be present in any mixtures, with the proviso that the boiling points of the relatively nonvolatile organosiloxanes used are greater than 130° C. at atmospheric pressure, where   R 1 , R 2 , R 3  and X are as defined above and can in each case be identical or different, and   a and b can be 0, 1, 2 or 3, with the proviso that the sum a+b is equal to 3, whose boiling points are greater than 130° C. at atmospheric pressure, where the thermal conductivity λ is in the range from 0.014 to 0.040 W/mK and the density is in the range from to 300 kg/m 3 , where the thermal insulation material has the following composition:   pyrogenic silica or silicon dioxide aerogels 5-98% by weight, opacifiers 3-50% by weight, further additives 0-65% by weight.   
     
     
         9 . The thermal insulation material as claimed in  claim 8 , characterized in that the relatively nonvolatile organosilanes used have the general formula
   R 1   n R 2   m SiX 4−(n+m)    (I)
   where n and m can be 0, 1, 2 or 3 and the sum n +m is less than or equal to 3 and   R 1  is a saturated or singly or multiply unsaturated, monovalent, Si—C-bonded C 1 -C 20 -hydrocarbon radical optionally substituted by —CN, —NCO, —NR 1 R 3 , —COOH, —COOR 2 , -halogen, -acryl, -epoxy, —SH, —OH or —CONR 2   2 , or an aryl radical or C 1 -C 15 -hydrocarbonoxy radical, in which one or more, nonadjacent methylene units can in each case be replaced by —O—, —CO—, —COO—, —OCO— or —OCOO—, —S— or —NR 1 - groups and in which one or more, nonadjacent methine units can be replaced by —N═, —N═N— or —P═ groups, and X=halogen, nitrogen radical, OR 3 , OCOR 3 , O(CH 2 ) 1 OR 3 , where   R 2  is hydrogen or a saturated or singly or multiply unsaturated, monovalent, Si—C-bonded C 1 -C 20 -hydrocarbon radical optionally substituted by —CN, —NCO, —NR 1   2 , —COOH, —COOR 1 , -halogen, -acryl, -epoxy, —SH, —OH or —CONR 3   2 , or an aryl radical or C 1 -C 15 -hydrocarbonoxy radical, in which one or more, nonadjacent methylene units can in each case be replaced by —O—, —CO—, —COO—, —OCO— or —OCOO—, —S— or —NR 1 - groups and in which one or more, nonadjacent methine units can be replaced by —N═, —N⊚N— or —P═ groups, and X=halogen, nitrogen radical, OR 3 , OCOR 3 , O(CH 2 ) 1 OR 3 , where   R 3  is as defined for R 2  and R 2  and R 3  can be identical or different,   X is a C—O-bonded C 1 -C 15 -hydrocarbon radical or an acetyl radical or a halogen radical or an OH radical,   and 1 =1, 2, 3,   or
   R 1   i R 2   j Si—Y—SiR 1   i R 2   j    (II)
 
   where   R 1  and R 2  are as defined above, i and j can be 0, 1, 2 or 3 and the sum i+j is equal to 3 and   Y can be the group NH or —O—,   with the proviso that the boiling points of the relatively nonvolatile organosilanes used are greater than 130° C. at atmospheric pressure.   
     
     
         10 . The thermal insulation material as claimed in  claim 8 , wherein the following infrared opacifiers are used: titanium oxides, zirconium oxides, ilmenites, iron titanates, iron oxides, zirconium silicates, silicon carbide, manganese oxides and carbon black. 
     
     
         11 . The thermal insulation material as claimed in  claim 9 , wherein the following infrared opacifiers are used: titanium oxides, zirconium oxides, ilmenites, iron titanates, iron oxides, zirconium silicates, silicon carbide, manganese oxides and carbon black. 
     
     
         12 . The thermal insulation material as claimed in  claim 8 , comprising the following additives: precipitated silicas, pyrogenic silicas, SiO 2 -containing fly dusts from electrochemical silicon production and the thermal utilization of residues of volatile silicon compounds and also naturally occurring SiO 2 -containing compounds, thermally expanded minerals. 
     
     
         13 . A molding, building block, building system or composite building system, characterized in that it comprises or consists partially or completely of thermal insulation material as claimed in  claim 8 .