Material for a molded resin for use in a semiconductor light-emitting device

Abstract

The present invention provides a material for a molded resin as a material for a semiconductor light-emitting device that can yield a highly durable (light resistance and heat resistance) molded resin and can also improve the LED output through an excellent reflectivity. The present invention also provides an easily moldable material for a molded resin for a semiconductor light-emitting device. The material for a molded resin for a semiconductor light-emitting device is a resin composition comprising (A) a polyorganosiloxane, (B) a white pigment, and (C) a curing catalyst, wherein the white pigment (B) has the following characteristics (a) and (b); (a) an aspect ratio 1.2 or more and 4.0 or less, and (b) a primary particle diameter 0.1 μm or more and 2.0 μm or less.

1 . A material for a molded resin for a semiconductor light-emitting device,
 the material comprising (A) a polyorganosiloxane, (B) a white pigment, and (C) a curing catalyst, wherein   the white pigment (B) has the following characteristics (a) and (b):   (a) a primary particle aspect ratio is 1.2 or more and 4.0 or less, and   (b) a primary particle diameter is 0.1 μm or more and 2.0 μm or less.   
     
     
         2 . The material for a molded resin according to  claim 1 , wherein a median diameter of secondary particles of the white pigment (B) is 0.2 μm or more and 5 μm or less. 
     
     
         3 . The material for a molded resin according to  claim 1 , wherein a viscosity at a shear rate of 100 s −1  and at 25° C. is 10 Pa·s or more and 10,000 Pa·s or less. 
     
     
         4 . The material for a molded resin according to  claim 3 , wherein a ratio of a viscosity at a shear rate of 1 s −1  to a viscosity at a shear rate of 100 s −1  is at least 15. 
     
     
         5 . The material for a molded resin according to  claim 1 , wherein the white pigment (B) is alumina. 
     
     
         6 . The material for a molded resin according to  claim 1 , wherein the ratio y/x of the median diameter y of the secondary particles in the white pigment (B) to the primary particle diameter x in the white pigment (B) is 1, or more and 10 or less. 
     
     
         7 . The material for a molded resin according to  claim 1 , wherein the polyorganosiloxane (A) is a thermosetting polyorganosiloxane that is a liquid at normal temperature and normal pressure. 
     
     
         8 . The material for a molded resin according to  claim 1 , further containing (D) a cure rate controlling agent. 
     
     
         9 . The material for a molded resin according to  claim 1 , further containing (E) a fluidity controlling agent. 
     
     
         10 . The material for a molded resin according to  claim 9 , wherein a total content of the white pigment (B) and the fluidity controlling agent (E) is at least 50 weight % with regard to the entire material for a molded resin. 
     
     
         11 . A molded resin for a semiconductor light-emitting device, that is obtained by molding the material for a molded resin according to  claim 1 . 
     
     
         12 . The molded resin according to  claim 11 , wherein a light reflectivity at a thickness of 0.4 mm and a wavelength of 400 nm is at least 60%. 
     
     
         13 . The molded resin according to  claim 11 , wherein the molded resin is molded by liquid injection molding. 
     
     
         14 . A method of producing a molded resin, comprising:
 a step of producing the material for a molded resin according to  claim 1 ; and   a step of molding the obtained material for a molded resin by injection molding.   
     
     
         15 . A semiconductor light-emitting device that has the molded resin according to  claim 11 . 
     
     
         16 . A material for a molded resin for a semiconductor light-emitting device,
 the material comprising (A) a polyorganosiloxane, (B) a white pigment, and (C) a curing catalyst, wherein   a viscosity at a shear rate of 100 s −1  and at 25° C. is 10 Pa·s or more and 10,000 Pa·s or less and   a ratio of a viscosity at a shear rate of 1 s −1  to a viscosity at a shear rate of 100 s −1  is least 15.